16+ Years Experience in PCB Manufacturing

  • 1-100 layers PCBs with VIPPO for Prototypes
  • FR4, High TG FR4, High Speed, High Frequency, Ceramic, Polyimide
  • Blind & Buried Vias, Micro Vias, Stacked Vias, Staggered Vias, Any-Layer HDI
  • VIPPO (Via-In-Pad Plated Over), Conductive & Non-Conductive via plugging
  • Impedance Control with 3% Tolerance
  • Backdrill, Backplane, Embedded Devices, IC Substrate

Introduction of VIPPO PCB

VIPPO are the abbreviation of Via In Pad Plated Over, also called resin plug hole, electroplating filling. So VIPPO technology is one plug-hole technology. Usually, we use this technology when PCB have vias in pad.

Before understanding VIPPO PCB, you should know what is via in pad. Via in pad, seeing the name of a thing, one thinks of its function means the via drilling in the pad. So this pad means SMD pad, which usually refers to SMD of 0603 and above. Also, it refers to the BGA pad. So VIP is short for via in pad.

To meet the conduction requirement inside the via and improve PCB wiring density, typically, we design via in pad, especially in the BGA area. Still, the BGA pad is small; if we design via in pad, there is almost no area for soldering components, so via in pad need to make resin plug hole and electroplating filling, that is VIPPO technology. We also call this kind of printed circuit board as POFV PCB (plated over filled via PCB).

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    Viasion’s Advantages As One of the Best VIPPO PCB Suppliers

    A wealth of experience

    Viasion was founded in 2007 and has rich production and management experience in production of VIPPO / POFV PCBs with via in-pad plated over.

    High standard & high quality

    We rely on our leading technical strength, perfect quality management system and advanced manufacturing equipment to improve the quality of our products and services.

    Competitive pricing

    Due to our rich experience in VIPPO PCB production, we can get a high yield rate. Then we can quote very competitive prices for our customers.

    Fast turnaround

    The fast turnaround of PCB manufacturing can be well realized in Viasion. So we can deliver POFV PCBs in 1 week, which explicitly characterizes our services.

    VIPPO Production Process

    Drill hole in pad→plating copper in holes→plug resin→solidification→polish→Copper reduction→Degumming→drilling other Non-via-in-pad holes ( usually refers to component holes and tooling holes)→plated hole copper and VIP surface copper→other normal process.

    VIPPO Plugging Via Methods

    Viasion usually uses VIPPO technology in the vacuum resin plugging process.

    The VIPPO plugging via method is a revolutionary technology offering PCB designers superior performance and reliability. This method allows PCBs to be assembled quickly, efficiently and cost-effectively without solder paste or traditional through-hole assembly techniques. The POFV via in pad plated over plugging via process also eliminates the risk of thermal damage associated with soldering and allows for higher component densities on the PCB due to its small diameter vias, making it an ideal choice for high-density applications such as mobile phones, tablets and other consumer electronics devices.

    The VIPPO plugging via process assembles PCBs without solder paste or traditional through-hole assembly techniques. In this process, electrically conductive vias are incorporated into the printed circuit board and then filled with a non-conductive material such as epoxy resin or an insulation gel. It creates a practical and secure plug that connects electrical components to the board without requiring traditional through-hole assembly techniques. Furthermore, this method utilizes a smaller via diameter than is possible with conventional through-hole assembly methods, enabling designers to increase component density on their PCBs. As a result, the POFV plugging via method offers superior performance and reliability to PCB designers and is an ideal choice for high-density applications.

    Why Do We Need to Make VIPPO in PCB?

    Someone interested in the VIPPO technology may ask, “Do I need to use VIPPO technology or SKIPPO if my PCB needs to design drilling in a pad and solder electronic components on it?” Yes, you got the point. By the way, VIPPO and SKIPPO(Skip Via in Pad Plated over ) are typically used in vias in BGA pads.

    Many may wonder, “What will happen if VIPPO in PCB is not made when there are vias in the pad?” If via in pad does not make POFV, it means not plugging via will cause the solder area to be small, tin ball hide in holes or oil explosion phenomenon, resulting in faulty soldering.

    The diameter of the VIPPO hole should be at most 0.5mm. Otherwise, the tin paste may flow into the hole, or the scaling powder will flow into the hole during the heating process, so then cause gas in the hole and resulting in insufficient connection strength.

    The process of via in-pad plated overr production can see picture below. The difference between VIPPO via and regular via is that it wears a Cu cap flush with the pad.

    If PCB uses VIPPO technology, the cost will increase by 15%-25%, and the pad will fall off more accessible than the regular pad, so we should try to select packages with large pin spacing. Some people may raise the question, “In that case, why do you still use plated over filled via to plug via?” It’s because VIPPO technology significantly improves the PCB wiring density, especially the BGA area, and also eliminates the capacitance effect. Usually, a ground layer below the BO/BO will engender a capacitance effect. VIPPO technology eliminates the capacitance effect.

    In addition, we recommend via in-pad plated over technology use with a back drilling process that can well meet the requirements of high-density, high-speed signal products.

    So whether we use VIPPO technology or not, we need to do a comprehensive assessment according to the characteristic of the products.

    Process Conditions of VIPPO

    Process standardization

    There are tens of thousands of resin plug holes in one PCB, and not allow any hole not plump filled. Some want to know, "Do PCB manufacturers require rigorous thinking and standardization in VIPPO technology before the plugging?" The answer is yes, given that even a defect of 1/10000 will lead to the probability of scrapping.

    Advanced plug-hole equipment

    Good plug-hole equipment is a requirement, of course. Now use in VIPPO plug-hole equipment can be divided into two categories: Vacuum plug hole machines and Non-vacuum plug hole machines.

    The Differences between Solder Mask Plug Via Technology and VIPPO Plug Via Technology

    VIPPO via in pad plated over technology: In simple terms, after the hole wall is coated with copper, use epoxy resin to fill and level the via, then burnish the surface, and then plate copper in the surface. The cost is high. We need to pay attention to some blind via products because the thickness of the blind layer is over 0.5mm. Lamination PP rubber filling can not fill up the blind via, will also need to use resin to fill up the blind via, avoid the blind via appearing without copper problem in the follow-up process.

    The differences between solder mask plug via technology and plated over filled via: Before the VIPPO plug via technology became widespread, high-frequency PCB manufacturers universal adoption more simple process of solder mask plug via technology, but solder mask plug via, the solder oil will shrink after solidification, very easy appear blowing in the hole problem, thus can not meet the requirement of high fullness of customer.

    On the other hand, VIPPO plug via technology uses resin to plug the blind via, then make the lamination process, perfectly solving the malpractice brought by solder mask plug via, also balances the contradiction between the thickness control of the pressed medium layer and the preliminary design of the inner blind hole sealant filling. Therefore, although VIPPO plug via technology process is relatively complex, and costs are high, plumpness, plug via quality will have more advantages than solder mask plug via.

    Solder mask plug via technology: solder mask plug via used in ordinary via in PCB; after plugging with solder mask, the surface is solder oil, can not electric conduction. Generally required after plug hole:

    A. Be sure to fill it up.

    B. Not allowed to have turned red or false copper exposure phenomenon.

    C. Not allowed to have plug too whole cause protuberance and higher than the pad that needs to make solder nearby, affecting SMT installation.

    The Advantages of VIPPO

    Improve soldering reliability

    VIPPO can improve soldering reliability. Some customs consider the lead time and cost, usually do not use VIPPO technology for via plugging, and choose solder mask plug via. As a result, it caused tremendous pressure on the rear soldering, causing the defect rate rising, and soldering reliability to reduce.

    Improve efficiency and non-defective rate

    VIPPO technology can improve the PCB designer's efficiency and the PCB's non-defective rate. Because in the PCB design, vias will occupy too much space and cause wiring difficulty, the designer has to use minimal traces like 3.5mil or smaller. Therefore, it will increase the production difficulty and increase cost. But if the vias are drilled in the pad, it saves a lot of space. As a result, the designer can use more space for wiring.


    Better electrical performance

    For high-frequency PCB, VIPPO technology is suitable for performance, better for electrical performance. Details as below: It allows for unprecedented levels of integration, flexibility, and scalability. This advanced technology can create high-performance printed circuit boards with increased performance and efficiency, allowing faster time-to-market cycles and improved product designs.

    The Disadvantages of VIPPO

    • The via drill in the pad, making via VIPPO, will extend the production process by at least three more days.
    • Via-in-pad plated over will increase the cost of PCB.

    Common Quality Problems and Improvement Methods of VIPPO

    Common quality problems of inner layer HDI buried, blind via VIPPO

    A. The bursting board problem will occur.

    B. There is blind hole resin protrusion, or there is no flatness.

    C. There is no copper in the hole.

    The results will cause by quality problems of inner layer HDI buried, blind via VIPPO

    A. Never take any quality problems above lightly, given that they will cause the scrapping of products.

    B. Some may raise their views, “ Will the resin protrusion or not flatness always cause uneven circuit, then cause open circuit and short circuit problems?” Yes, these problems will be caused by that.

    Preventive and improvement measures for quality problems of inner layer HDI buried, blind via VIPPO

    People familiar with the PCB industry may share his idea, “Is controlling the fullness of the inner HDI plug-hole useful in preventing or improving board explosion?” Of course, what a point!
    If you choose to plug the hole after the circuit process, you must control the time from the plug hole to the lamination process very well and carefully clean the board surface.
    Some experienced readers may add a thought, “It’s necessary to well control the polishing and flattening of resin during hole plugging to prevent the resin protrusion problem, am I right?” Yes, you are right.

    Conclusion: VIPPO PCBs offer a unique solution to produce reliable and efficient electronic products.

    VIPPO technology and VIPPO PCBs offer a unique solution for manufacturers looking to create reliable, efficient products. The combination of advanced materials science, innovative design techniques, and sophisticated production processes make them an attractive option for companies seeking high-quality components that can withstand the test of time. With their long-lasting durability and superior performance capabilities, VIPPO boards are ideal for any application where reliability is paramount. Whether you’re designing consumer electronics or medical devices, VIPPO via in pad plated over technology has something to offer your business. So why not experience the future of PCB manufacturing with VIPPO today? From design to production, VIPPO has the expertise and experience to provide cost-effective solutions that make your products stand out. With 16+ years of experience, Viasion is proficient in performing advanced via in pad plated over technology. With Viasion’s commitment to quality and customer satisfaction, you can count on us for high-performance VIPPO PCBs that will exceed your expectations. We want to become a long-time partner for our customers. Contact us today to get started on your next project!

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    Frequently Asked Questions

    VIPPO PCBs are a type of circuit board made by the method of first plugging vias with resin and then plating copper on top.

    1. The vias are plugged first and then over-plated flat, so they are very robust and can deal with various temperatures and environmental conditions.
    2. VIPPO pads are suitable for PCB assembly, avoiding solder leakage problems in the BGA assembly process.
    1. Suitable for BGA assembly, avoid solder voids in PCB assembly
    2. Superior and stable signal integrity
    3. Improved thermal management
    4. Increased reliability
    5. Ideal for applications requiring complex routing and high data speeds

    Yes. In the VIPPO PCBs process, we need to add via plug process and one more copper plating process. The processes are: drill via → plug via by epoxy → dry and then grind the vias flat → copper plating.

    In a typical usage condition with proper heat dissipation and insulation measures, VIPPO PCBs should last for more than 15 years before replacement.

    VIPPO PCBs are typically more expensive than standard PCBs. VIPPO PCBs must be designed and manufactured to stringent specifications, increasing the complexity of the manufacturing process.