teflon pcb for for aerospace applications

Polyimide with the best thermal performance, including Tg greater than 250°C, decomposition temperature >400°C, and T300>60 min. 

• Low z-expansion of 1.2% between 50-260°C (vs. 2.5-4.0% for typical  high-performance epoxies) offering superior PTH reliability through  process and in-service  

• Low Z-expansion minimizes the risk of latent PTH defects caused  during solder reflow and device attachment. 

• Decomposition temperature of 407°C, compared with 300-360°C for typical high-performance epoxies, offering outstanding longterm high-temperature performance  

• Up to 50% or more reduction in cure time compared with  traditional polyimide cycles 

• Electrical and mechanical properties meeting the requirements of  IPC-4101/40 and /41 • Toughened, Non-MDA chemistry resists drill cracking 

• Halogen-free chemistry

• Compatible with lead-free processing

• RoHS/WEEE compliant