PCB Materials

To meet the different functions and different usage of various PCBs, a lot of materials were invented during the development of printed circuit board manufacturing. From the lowest standards material: FR1, FR2, CEM1, CEM3, to higher standard materials: FR4, High TG FR4, Aluminum, to high standard materials such as high speed, high frequency, PTFE, Ceramic, polyimide, IC substrate material, etc.

Viasion manufactures PCBs with various types of materials, including conventional FR4, high TG FR4, high-frequency FR4, high-speed FR4, halogen-free FR4, polyimide, high thermal conductive CEM3, aluminium/copper base, PTFE/Teflon, Ceramic, Alumina, Semi-flex, IC substrate etc. All these PCB materials come from the most famous brands in the market.

The following list is the most commonly used PCB materials brands with some typical parameters.

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    Type Glass transient temperature (Tg) Dielectric constant (Dk) Main suppliers
    FR4
    135°C
    3,8-4,7
    Shengyi, Isola, Nanya, ITEQ, KB
    High TG FR4
    170-180°C
    3,8-4,6
    Shengyi, Isola, KB, Nanya, ITEQ
    Halogen Free FR4
    135-170°C
    4,5 -4,9
    Shengyi, Isola, KB, Nanya, ITEQ
    High Speed FR4
    135-180°C
    Low Dk: 3.0-4.0; Low Df: 0.001-0.01
    TUC, Shengyi, Isola, Ventec, Rogers, ITEQ, Panasonic
    CEM3
    120-130°C
    4,5 -4,9
    Shengyi, KB
    RF & Microwave
    135-280°C
    Low Dk: 2.2-3.5; Low Df: 0.001-0.01
    Rogers, Panasonic, Isola, Ventec, AGC, Arlon, TUC, Shengyi
    Ceramic
    135-280°C
    Low Dk: 2.2-3.5; Low Df: 0.001-0.01
    Rogers, Shengyi, ITEQ
    Polyimide for Rigid PCB
    250-300°C
    4,0-4,5
    Arlon, Nelco
    Alumina
    250–350°C
    Thermal Conductivity(W/m°C): 15-170
    Chinese local brand
    Semiflex
    135-170°C
    3,8-4,7
    ISOLA, ITEQ, Shengyi
    Polyimide for Flex PCB
    195-220°C
    3,0-3,5
    Dupont, Panasonic, Taiflex
    Aluminum/Copper Based
    100-170°C
    Thermal Conductivity(W/m°C): 1.0-4.0
    Laird, Bergquist, Ventec, Shengyi, ITEQ,TOTKING
    IC Substrate
    170-220°C
    4,0-5,0
    MGC, Hitach, Doosan, LG,Ajinomoto

    Short description of PCB base material.

    1
    FR4

    FR4 is a glass fibre epoxy laminate meets UL 94V-0 standard. FR4 material is the most commonly used PCB material in electronic products.

    2
    High TG FR4

    It is an enhanced FR4 material which can withstand higher temperatures, both in process and usage.

    3
    Halogen Free FR4

    It is an improved material which does not contain halogen, it is harmless to the human body, which is usually required in the products needed to touch the human body.

    4
    High Speed FR4

    High speed FR4 substrate is FR4 material suitable for high-speed signal transmission, from 1Ghz to 100Ghz by far.

     
    5
    CEM3

    CEM3 is material with epoxy over a paper core, it is a lower grade of substitute for FR4. But we always recommend using FR4 instead of CEM3 for better reliability.

    6
    RF & Microwave

    It is high PCB material with 300MHz or higher electromagnetic frequency, used in electronics need high-frequency signal transmission.

    7
    Ceramic

    Glass reinforced or PTFE-reinforced ceramic materials are used to produce high-frequency and high-speed PCBs.

    8
    Polyimide for Rigid PCB

    It is the ultimate polyimide material used in PCBs which needs to be used in resistance to extremely high temperatures.

    9
    Alumina

    PCB material is made of Aluminium Oxide(Al2O3) which always has very high Thermal Conductivity.

    10
    Semi-flex

    It is a kind of FR4 which has little flexibility. PCBs can be bent in a certain angle only a few times when dissembled. Usually, only one time when assembly the PCB on electronic products.

    11
    Polyimide for Flex PCB

    Material is made by polyimide which can be bent or folded many times. It is usually used to produce flexible PCBs and rigid flex PCBs.

    12
    Aluminium/Copper Based

    It is a material which has high Thermal Conductivity and is usually used on high-power lighting products, or products that need very high heat dissipation rate.

    13
    IC Substrate

    It is a high-tech material made of ceramic, PI (polyimide) or PE (polyester) material to produce PCBs to carry IC as a carrier and connect the signal between the chip and the printed circuit board (PCB).

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