PCB Assembly Capabilities

Using the the latest SMT and through hole equipment and processes, our experienced staff can manufacture quality and reliable products in timely manner, from prototype through to large volume assembly.

One-stop Solution

We supply one-stop solution for PCB fabrication and PCB assembly. We maintain full control of the entire process from PCB fabrication to assembly, so you don’t have to manage multiple vendors. You send send us the files packages, and we will deliver the fully functional printed circuits with all components populated.

High Quality

Quality is not just a slogan for us, but the No.1 Priority in our heart. We use the best raw materials and strictly follow the international standards such as UL, IPC-A-600, IPC-A-610 to make our products meet the international hardstands and also custom’s requirements.
  • DFM (Design For Manufacture) before production
  • Electrical Test (E-test)
  • AOI (Automated Optical Inspection)
  • ICT (In-circuit Test)
  • FCT (Functional Test)
  • X-ray inspection
  • Bespoke test as per customer's requirement

Advanced Capabilities

Utilize the latest requirement and technology, our experienced staff can produce PCB assembly with capabilities, including Surface Mount Technology (SMT), Thru-hole, and mixed technology (SMT with Thru-hole) for single-sided and double-sided placement on e PCB. We can place many surface mount packages including BGA, uBGA,QFN, DFN, SOP, PLCC, POP, CGA, CSP and passives down to 0201. A high level of placement accuracy, solder joint integrity and quality is consistently achieved.

Please refer to our details PCB Assembly Capabilities as below.

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    Assembly Types

    • Surface Mount (SMT)
    • Thru-hole
    • Mixed Technology (SMT/Thru-hole)
    • Single or double sided placement
    • Rigid, Flexible PCB and Rigid flex PCB Assembly
    • High pin count press fit capable

    Parts Procurement

    • Turnkey PCB Components sourcing
    • Kitted/Consigned
    • Partial Turnkey

    Component Types

    • Passive Components as small as 0201
    • Ball Grid Arrays (BGA) as small as 0.3mm pitch
    • BGA, uBGA,QFN, DFN, SOP, PLCC, POP, CGA, CSP and Leadless chips
    • All kinds of passive and active components

    SMT components packaging types

    • Cut Tape
    • Partial Reel
    • Full Reel
    • Tube (preferred a whole tube)
    • Tray

    PCB Board Dimensions Available

    • Smallest size: 0.2" x 0.2"
    • Largest size: 20'' x 28"

    Lead times

    • Prototype: 1 week
    • Mas production: 2-4 weeks
    • Quick turn as customer’s requirement


    • No minimum order quantity
    • Engineering prototypes
    • Small series production
    • Mass production in high volume


    • AOI (Automated Optical Inspection)
    • X-ray Inspection for BGA
    • ICT (In-circuit Test)
    • FCT (Functional Test)
    • Visual Inspection

    Files required for PCB assembly

    • Bill Of Materials
    • Pick and Place File
    • Assembly Drawings
    • Gerber File
    • NC Drill File
    • Other fabrication and assembly drawing

    Other Capabilities

    • Repair/Rework services
    • Mechanical Assembly
    • Electromechanical Assembly
    • Box Build Assembly
    • IC Programming
    • Conformal coating
    • Cable and Wire Harness Assembly
    • IPC-A-610 Class 3 available
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    Viasion Technology is your trusted partner & one-stop shop for PCB fabrication, components sourcing, PCB assembly and electronic manufacturing. With more than 16 years of experience, we have been supplying high-quality PCBs with competitive pricing for 1000+ customers worldwide. Our company is ISO9001:2015 Certified & UL Listed, and all our products are 100% E-tested and inspected by AOI & X-RAY to meet the highest industry standards. So please get an instant quote from our sales team now, and we will take care of the rest.