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2021
DATE
03 - 18
How to prevent the warpage and deformation of the board in the production of PCB printed circuit boards
Why is the circuit board required to be very flat on the automated assembly line, if the printed board is not flat, it will cause inaccurate positioning, components can not be inserted into the holes of the board and the surface mounting pads, and even the automatic insertion machine will be damaged . The board with the components is bent after welding, and the component feet are difficult to cut flat and uniform. The board cannot be installed on the chassis or the socket inside the machine, so the assembly plant is also very upset when the board is warped. At present, printed boards have entered the period of appearance devices and chip devices, and assembly plants must have stricter and stricter requirements for board warping.
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2021
DATE
02 - 19
Causes and solutions of green oil blistering after circuit board reflow soldering
The blistering of the circuit board after reflow soldering refers to the blistering of the solder mask green oil on the circuit board. This phenomenon is that light green bubbles will appear around individual solder joints after reflow soldering on the printed circuit board with components pasted.
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2021
DATE
02 - 05
What are the differences between circuit board tin spraying and tin sinking?
There are two common processes for printed circuit boards: tin spraying and tin sinking, both of which are surface treatment methods to meet the requirements of lead-free soldering. But in the circuit board process, tin sinking is not known to most people. The following editor will talk about the di
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2021
DATE
01 - 30
Five reasons and preventive measures for the solder resist hole of the circuit board
In the production of circuit board solder resist, there is often the phenomenon of solder resist hole, causing unnecessary rework, time-consuming and laborious, then what causes the solder resist hole and what preventive measures are there, the following editor will explain in detail One said.
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2021
DATE
01 - 21
Introduction to the difference between circuit board immersion gold process and gold plating
In the circuit board production process, the immersion gold and gold plating process are very common processes. Because these two processes solve the problem of the soldering process, the pads are difficult to flatten. As the society is strict with the function and size of electronic products As the
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2021
DATE
01 - 18
In the circuit board surface treatment process, which is better, tin spraying or immersion gold
Immersion gold and spray tin are two common processes for circuit board surface treatment. What is the difference between these two processes? Which process is better? Most people are not very clear. Shenzhen VIASION Technology Co., Ltd. Just take everyone to learn about these two processes.
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2021
DATE
01 - 12
How to solve the problem of substrate size changes during the production of circuit boards?
Reasons for changes in the size of the substrate during the circuit board production process:   The difference in the warp and weft directions causes the size of the substrate to change; due to the lack of attention to the fiber direction during shearing, the shear stress remains in the substrate. O
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2021
DATE
01 - 05
What is the function of the resin plug hole of the circuit board
In the 1990s, a Japanese company developed a resin that directly plugged the hole and then plated copper on the surface, mainly to solve the problem of air blowing in the green oil plug hole. Intel applied this process to Intel's electronic products, giving birth to the so-called POFV (some factorie
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2021
DATE
01 - 04
Introduction to common surface treatment processes of circuit boards
The most basic purpose of surface treatment is to ensure good solderability or electrical properties. Since natural copper tends to exist in the form of oxides in the air, it is unlikely to remain as original copper for a long time, so other treatments are needed for copper. Although in the subseque
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