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printed circuit board

If you want to know more about the printed circuit board, the following articles will give you some help. These news is the latest market situation, trend in development, or related tips of the printed circuit board industry. More news about printed circuit board, are being released. Follow us / contact us for more printed circuit board information!
2021
DATE
04 - 10
What pre-work needs to be done before PCB design
Before starting the wiring, the PCB design should be carefully analyzed and the tool software should be carefully set, which will make the PCB design more in line with the requirements. Next, Shenzhen VIASION Electronic Technology Co., Ltd. will introduce to you what preparatory work needs to be d
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2021
DATE
04 - 08
Why add test points to the circuit board design?
The circuit board design and test points are not used in the production of PCB boards, but after the PCBA is completed, ICT tests are performed to test whether the circuit board soldering has problems and whether the performance meets the requirements. The circuit board also needs to be tested du
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2021
DATE
03 - 27
The circuit board chip manufacturer tells you why you can't touch the circuit board with your hands?
The circuit board manufacturer tells you why you can't touch the circuit board with your hands? In winter, the human body can release up to tens of thousands of volts of static electricity. At the end of the year, the project has reached the final stage. Don't directly touch the live motherboard w
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2021
DATE
03 - 23
Precautions for circuit board soldering
The principle of soldering is a process in which a solid solder wire is heated and melted by a heated soldering iron, and then flows into the metal to be soldered with the help of flux, and forms a firm solder joint after cooling. When the solder is a tin-lead alloy and the soldering surface is copper, the solder first wets the soldering surface. With the wetting phenomenon, the solder gradually diffuses into the metal copper, forming an adhesion layer on the contact surface of the solder and the metal copper, so that both Combine firmly.
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2021
DATE
03 - 22
PCB vocabulary Chinese and English comparison
Printed circuit comprehensive vocabulary 1、 印制电路:printed circuit 2、 印制线路:printed wiring 3、 印制板:printed board 4、 印制板电路:printed circuit board (PCB) 5、 印制线路板:printed wiring board(PWB) 6、 印制元件:printed component 7、 印制接点:printed contact 8、 印制板装配:printed board assembly 9、 板:board 10、 单面印制板:single-sided printed board(SSB) 11、 双面印制板:double-sided printed board(DSB) 12、 多层印制板:mulitlayer printed board(MLB)
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2021
DATE
03 - 18
How to prevent the warpage and deformation of the board in the production of PCB printed circuit boards
Why is the circuit board required to be very flat on the automated assembly line, if the printed board is not flat, it will cause inaccurate positioning, components can not be inserted into the holes of the board and the surface mounting pads, and even the automatic insertion machine will be damaged . The board with the components is bent after welding, and the component feet are difficult to cut flat and uniform. The board cannot be installed on the chassis or the socket inside the machine, so the assembly plant is also very upset when the board is warped. At present, printed boards have entered the period of appearance devices and chip devices, and assembly plants must have stricter and stricter requirements for board warping.
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2021
DATE
03 - 13
Circuit board manual soldering process
Circuit board manual soldering process
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2021
DATE
03 - 10
Quality inspection of prepreg PP for circuit board
The prepreg is a sheet material. The resin is in the B-stage, under the action of temperature and pressure, it has fluidity and can quickly cure and complete the bonding process, and forms an insulating layer together with the carrier. Commonly known as prepreg or bonding film. In order to ensure the high reliability and quality stability of the multilayer printed circuit board, the quality of the semi-solid film characteristics must be tested (trial lamination method). The characteristics of the circuit board electroplating prepreg include the characteristics before lamination and the characteristics after lamination. The characteristics before lamination mainly refer to: resin content%, fluidity%, volatile content% and gel time (S). The characteristics after lamination refer to: electrical properties, thermal shock properties and flammability.
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2021
DATE
03 - 09
Four points to pay attention to when PCB high-frequency board wiring
For pcb high-frequency boards, four points need to be paid attention to when designing wiring, which will be discussed in detail below.
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2021
DATE
03 - 05
What inspections need to be done before SMT patch processing?
Shenzhen VIASION Electronic Technology Co., Ltd. has its own SMT chip factory, which can provide SMT chip processing services for 0201 components in the smallest package, and supports various processing forms such as processing with supplied materials and OEM materials. Next, I will introduce to you what inspections need to be done before SMT patch processing?
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