The circuit board manufacturer tells you why you can't touch the circuit board with your hands? In winter, the human body can release up to tens of thousands of volts of static electricity. At the end of the year, the project has reached the final stage. Don't directly touch the live motherboard w

Today, Shenzhen VIASION Electronic Technology Co., Ltd. will talk to you about the method of identifying the IC mark and pin sequence. Let’s take a look at it together. There are many ways for circuit board manufacturers to identify the IC mark and pin sequence. Now the common identification meth

The principle of soldering is a process in which a solid solder wire is heated and melted by a heated soldering iron, and then flows into the metal to be soldered with the help of flux, and forms a firm solder joint after cooling. When the solder is a tin-lead alloy and the soldering surface is copper, the solder first wets the soldering surface. With the wetting phenomenon, the solder gradually diffuses into the metal copper, forming an adhesion layer on the contact surface of the solder and the metal copper, so that both Combine firmly.

Why is the circuit board required to be very flat on the automated assembly line, if the printed board is not flat, it will cause inaccurate positioning, components can not be inserted into the holes of the board and the surface mounting pads, and even the automatic insertion machine will be damaged . The board with the components is bent after welding, and the component feet are difficult to cut flat and uniform. The board cannot be installed on the chassis or the socket inside the machine, so the assembly plant is also very upset when the board is warped. At present, printed boards have entered the period of appearance devices and chip devices, and assembly plants must have stricter and stricter requirements for board warping.

Circuit board manual soldering process

The prepreg is a sheet material. The resin is in the B-stage, under the action of temperature and pressure, it has fluidity and can quickly cure and complete the bonding process, and forms an insulating layer together with the carrier. Commonly known as prepreg or bonding film. In order to ensure the high reliability and quality stability of the multilayer printed circuit board, the quality of the semi-solid film characteristics must be tested (trial lamination method). The characteristics of the circuit board electroplating prepreg include the characteristics before lamination and the characteristics after lamination. The characteristics before lamination mainly refer to: resin content%, fluidity%, volatile content% and gel time (S). The characteristics after lamination refer to: electrical properties, thermal shock properties and flammability.

For pcb high-frequency boards, four points need to be paid attention to when designing wiring, which will be discussed in detail below.

Shenzhen VIASION Electronic Technology Co., Ltd. has its own SMT chip factory, which can provide SMT chip processing services for 0201 components in the smallest package, and supports various processing forms such as processing with supplied materials and OEM materials. Next, I will introduce to you what inspections need to be done before SMT patch processing?

What materials need to be prepared before PCB layout design?

The green color on the surface of the board that we often see is the solder mask ink. The main components are talc, resin and pigment. Nowadays, the famous inks on the market mainly include Japan Sun Ink, Taiwan Nanya Resin, Taiwan Changxing Chemical, Taiwan Yongshengtai Ink, Guangxin Ink, Taiwan