In the circuit board production process, the immersion gold and gold plating process are very common processes. Because these two processes solve the problem of the soldering process, the pads are difficult to flatten. As the society is strict with the function and size of electronic products As the

How long the circuit board is stored depends on the surface treatment. Gold and electroplated gold are the longest. They can be stored for two or three years under constant temperature and humidity conditions. Followed by tin spraying and oxidation resistance. Especially for anti-oxidation, it is be

In the electronic processing industry, there are wave soldering and manual soldering methods for plug-in materials in PCBA processing. What are the differences between these two soldering methods and what are the advantages and disadvantages? Next, VIASION PCBA processing manufacturer-Shenzhen Weish

Immersion gold and spray tin are two common processes for circuit board surface treatment. What is the difference between these two processes? Which process is better? Most people are not very clear. Shenzhen VIASION Technology Co., Ltd. Just take everyone to learn about these two processes.

Treatment method of poor tin on circuit board:

Reasons for changes in the size of the substrate during the circuit board production process: 　　The difference in the warp and weft directions causes the size of the substrate to change; due to the lack of attention to the fiber direction during shearing, the shear stress remains in the substrate. O

OSP is a process for surface treatment of printed circuit board (PCB) copper foil that meets the requirements of the RoHS directive.

The welding process of the circuit board is an important part of the circuit board manufacturing process. When the circuit board is welded, it will often happen that the welding fails or the copper foil of the circuit board is damaged. Therefore, it is necessary to master certain skills when solderi

In the 1990s, a Japanese company developed a resin that directly plugged the hole and then plated copper on the surface, mainly to solve the problem of air blowing in the green oil plug hole. Intel applied this process to Intel's electronic products, giving birth to the so-called POFV (some factorie

The most basic purpose of surface treatment is to ensure good solderability or electrical properties. Since natural copper tends to exist in the form of oxides in the air, it is unlikely to remain as original copper for a long time, so other treatments are needed for copper. Although in the subseque