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printed circuit board assembly

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2021
DATE
01 - 14
How to deal with poor tin on circuit boards?
Treatment method of poor tin on circuit board:
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2021
DATE
01 - 12
How to solve the problem of substrate size changes during the production of circuit boards?
Reasons for changes in the size of the substrate during the circuit board production process:   The difference in the warp and weft directions causes the size of the substrate to change; due to the lack of attention to the fiber direction during shearing, the shear stress remains in the substrate. O
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2021
DATE
01 - 05
What is the function of the resin plug hole of the circuit board
In the 1990s, a Japanese company developed a resin that directly plugged the hole and then plated copper on the surface, mainly to solve the problem of air blowing in the green oil plug hole. Intel applied this process to Intel's electronic products, giving birth to the so-called POFV (some factorie
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2021
DATE
01 - 04
Introduction to common surface treatment processes of circuit boards
The most basic purpose of surface treatment is to ensure good solderability or electrical properties. Since natural copper tends to exist in the form of oxides in the air, it is unlikely to remain as original copper for a long time, so other treatments are needed for copper. Although in the subseque
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2020
DATE
12 - 23
What are the requirements for the spacing of printed circuit board wires
What are the requirements for the spacing of printed circuit board wires? The editor believes that the distance between adjacent wires must meet electrical safety requirements, and in order to facilitate operation and production, the distance should be as wide as possible. The minimum distance must
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