When the line is less than 25 mm from the edge of the board, the line impedance value is 1~4 ohms smaller than the middle of the board, and the impedance value is less affected by the position when the line is more than 50 mm from the board edge. Next, it is recommended to preferentially select the

The copy board is also called the change board, which is the reverse technology research on the designed PCB board. With reference to a large amount of information, the process of copying boards is summarized as follows: The first step is to get a PCB. First, record the model, parameters, and positi

The positive film of the circuit board: generally the pattern process we are talking about, the liquid used is an alkaline etching positive film. If the negative film is used, the desired line or copper surface is black, and the part is transparent, and the same is true. After exposure by the line p

PCB design requires different grid settings at different stages. In the layout phase, large grid points can be used for device layout.For large devices such as ICs and non-positioning connectors, 50 to 100 mil grid precision can be used for layout. For passive small devices such as resistors, capaci

PCB copy board steps _ detailed full versionThe first step: preparationGet a good circuit board to see if there are components with high position. If you have the component number, component package, temperature value, etc., make detailed records. Scan as a backup before disassembling the component.

When you finished your design in Eagle, the last step before sending it off to the fab house is to generate gerber files. Autodesk EAGLE includes a handy computer-aided manufacturing (CAM) processor that allows you to load a CAM file and quickly generate the specific files you need for your design.1

HASL - Tin/Lead hot air solder levelTypical thickness 1 - 40um. Shelf life:12 monthsExcellent solderabilityInexpensive / Low costAllows large processing windowLong industry experience / well known finishMultiple thermal excursionsDifference in thickness / topography between large and small padsNot s