The blistering of the circuit board after reflow soldering refers to the blistering of the solder mask green oil on the circuit board. This phenomenon is that light green bubbles will appear around individual solder joints after reflow soldering on the printed circuit board with components pasted.

In the production of circuit board solder resist, there is often the phenomenon of solder resist hole, causing unnecessary rework, time-consuming and laborious, then what causes the solder resist hole and what preventive measures are there, the following editor will explain in detail One said.

In the circuit board production process, the immersion gold and gold plating process are very common processes. Because these two processes solve the problem of the soldering process, the pads are difficult to flatten. As the society is strict with the function and size of electronic products As the

Immersion gold and spray tin are two common processes for circuit board surface treatment. What is the difference between these two processes? Which process is better? Most people are not very clear. Shenzhen VIASION Technology Co., Ltd. Just take everyone to learn about these two processes.

In the 1990s, a Japanese company developed a resin that directly plugged the hole and then plated copper on the surface, mainly to solve the problem of air blowing in the green oil plug hole. Intel applied this process to Intel's electronic products, giving birth to the so-called POFV (some factorie

The most basic purpose of surface treatment is to ensure good solderability or electrical properties. Since natural copper tends to exist in the form of oxides in the air, it is unlikely to remain as original copper for a long time, so other treatments are needed for copper. Although in the subseque