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electronic manufacturing services

These are related to the electronic manufacturing services news, in which you can learn about the latest trends in electronic manufacturing services and related information industry, to help you better understand and expand electronic manufacturing services market.
2022
DATE
02 - 25
Precautions for packaging inspection after SMT processing
After the SMT processing is completed,the packaging needs to be inspected to ensure that the PCBA products delivered to the customer are working properly and reliably. ShenZhen PCBA processing manufacturer - Viasion Technology Co. Ltd will introduce the packaging inspection after SMT processing.
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2021
DATE
02 - 26
Explain in detail the reasons for the circuit board open circuit caused by each production process
The production of circuit boards is a tedious process, requiring multiple processes to make a complete circuit board. If there is an error in some process production, it will lead to the production of circuit board products that do not meet the requirements. For example, the common PCB circuit board disconnection and open circuit problem will directly affect the function realization of the circuit board. Below, Shenzhen VIASION Electronic Technology Co., Ltd. will explain in detail the reasons for the circuit board open circuit caused by each production process.
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2021
DATE
02 - 20
What is the meaning of opening the window of the solder mask of the circuit board? What is the reason for the opening of the solder mask of the circuit board
The circuit board industry has windows in many manufacturing processes. It is a professional term for this industry, mainly referring to solder mask opening: using film to open the window, the PAD that needs to be soldered or dissipated is exposed to the green Outside the oil layer, in order to meet
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2018
DATE
11 - 15
PCBA test fixture production point analysis
PCBA testing is an extremely important part of the entire electronic manufacturing service. It can strictly control the quality of shipments in the final stage, and find problems in time to adjust the previous processes such as SMT and DIP, optimize the process, and realize the layering with a detec
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