Today, Shenzhen VIASION Electronic Technology Co., Ltd. will talk to you about the method of identifying the IC mark and pin sequence. Let’s take a look at it together. There are many ways for circuit board manufacturers to identify the IC mark and pin sequence. Now the common identification meth

Why is the circuit board required to be very flat on the automated assembly line, if the printed board is not flat, it will cause inaccurate positioning, components can not be inserted into the holes of the board and the surface mounting pads, and even the automatic insertion machine will be damaged . The board with the components is bent after welding, and the component feet are difficult to cut flat and uniform. The board cannot be installed on the chassis or the socket inside the machine, so the assembly plant is also very upset when the board is warped. At present, printed boards have entered the period of appearance devices and chip devices, and assembly plants must have stricter and stricter requirements for board warping.

The prepreg is a sheet material. The resin is in the B-stage, under the action of temperature and pressure, it has fluidity and can quickly cure and complete the bonding process, and forms an insulating layer together with the carrier. Commonly known as prepreg or bonding film. In order to ensure the high reliability and quality stability of the multilayer printed circuit board, the quality of the semi-solid film characteristics must be tested (trial lamination method). The characteristics of the circuit board electroplating prepreg include the characteristics before lamination and the characteristics after lamination. The characteristics before lamination mainly refer to: resin content%, fluidity%, volatile content% and gel time (S). The characteristics after lamination refer to: electrical properties, thermal shock properties and flammability.

The blistering of the circuit board after reflow soldering refers to the blistering of the solder mask green oil on the circuit board. This phenomenon is that light green bubbles will appear around individual solder joints after reflow soldering on the printed circuit board with components pasted.

In the production of circuit board solder resist, there is often the phenomenon of solder resist hole, causing unnecessary rework, time-consuming and laborious, then what causes the solder resist hole and what preventive measures are there, the following editor will explain in detail One said.

The role of blind vias is to conduct the left and right sides, so as to ensure the reliability of the circuit board! Blind holes are distributed in some layers, and buried holes are distributed in the middle layer, and through holes are distributed in all layers. Blind holes generally return All are

Immersion gold and spray tin are two common processes for circuit board surface treatment. What is the difference between these two processes? Which process is better? Most people are not very clear. Shenzhen VIASION Technology Co., Ltd. Just take everyone to learn about these two processes.

First, the characteristics of SMTThe assembly density is high, the size of the electronic product is small, and the weight is light. The volume and weight of the chip components are only about 1/10 of that of the conventional plug-in components. After the SMT is generally used, the volume of the ele