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2021
DATE
01 - 21
Introduction to the difference between circuit board immersion gold process and gold plating
In the circuit board production process, the immersion gold and gold plating process are very common processes. Because these two processes solve the problem of the soldering process, the pads are difficult to flatten. As the society is strict with the function and size of electronic products As the
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2021
DATE
01 - 20
How long is the storage time of the four-layer circuit board
How long the circuit board is stored depends on the surface treatment. Gold and electroplated gold are the longest. They can be stored for two or three years under constant temperature and humidity conditions. Followed by tin spraying and oxidation resistance. Especially for anti-oxidation, it is be
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2021
DATE
01 - 14
How to deal with poor tin on circuit boards?
Treatment method of poor tin on circuit board:
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2021
DATE
01 - 12
How to solve the problem of substrate size changes during the production of circuit boards?
Reasons for changes in the size of the substrate during the circuit board production process:   The difference in the warp and weft directions causes the size of the substrate to change; due to the lack of attention to the fiber direction during shearing, the shear stress remains in the substrate. O
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2021
DATE
01 - 09
What is the meaning of the circuit board OSP (anti-oxidation) process and its advantages and disadvantages
OSP is a process for surface treatment of printed circuit board (PCB) copper foil that meets the requirements of the RoHS directive.
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2021
DATE
01 - 08
Circuit board welding processing skills
The welding process of the circuit board is an important part of the circuit board manufacturing process. When the circuit board is welded, it will often happen that the welding fails or the copper foil of the circuit board is damaged. Therefore, it is necessary to master certain skills when solderi
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2021
DATE
01 - 05
What is the function of the resin plug hole of the circuit board
In the 1990s, a Japanese company developed a resin that directly plugged the hole and then plated copper on the surface, mainly to solve the problem of air blowing in the green oil plug hole. Intel applied this process to Intel's electronic products, giving birth to the so-called POFV (some factorie
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2021
DATE
01 - 04
Introduction to common surface treatment processes of circuit boards
The most basic purpose of surface treatment is to ensure good solderability or electrical properties. Since natural copper tends to exist in the form of oxides in the air, it is unlikely to remain as original copper for a long time, so other treatments are needed for copper. Although in the subseque
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2020
DATE
12 - 04
Welding and inspection of the first surface assembly board of SMT patch
The first piece of isoline SMT processing refers to the first surface assembly board that meets the welding quality requirements.
1. Welding of the first surface assembly board Place the surface assembly board that has passed the mounting and inspection on the mesh conveyor belt or chain guide rail.
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2020
DATE
12 - 02
Inspection method of solder joint quality and appearance in smt patch processing
Today's electronic products are pursuing miniaturization and portability, which requires the core part of these electronic products, the pcb circuit board, to be smaller and lighter, which also requires the use of smt chip processing technology.The quality and reliability of solder joints in smt chi
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