High-Quality Multilayer PCBs with Competitive Pricing

  • Rigid, Flex, Rigid-flex, HDI, High TG, High Speed, High Frequency, Backplane, Embedded PCBs, IC Substrate
  • 4-40 Layers Mass Production & upto 100 Layers Prototypes
  • Blind & Buried Vias, Staged & Staggered Vias, Back Drill
  • Conductive & Non-conductive Via Plugging, VIAPPO
  • ISO9001:2015 Certified & UL Listed
  • 100% E-test, AOI Test & Visual Inspection

What Is A Multilayer PCB?

As the name of multilayer PCB, the difference between multilayer PCB and single and double-sided PCB, in essence, is that their number of layers is not the same. But, of course, multilayer PCB has more layers, and the number of layers of multilayer printed circuit board is in three or more layers.

Viasion has rich experience in production and cooperation, both single panel and dual panel, including multilayer PCB board. They are the same when it comes to connecting circuits.

According to Viasion‘s production experience, most are connected by the through hole on the board unless there are special requirements and circumstances. This is because the production principle of multilayer PCB manufacturing is very different from the traditional production method.

The multi-layer PCB is drilled and electroplated before rolling synthesis. Based on Viasion’s experience, the inner part is usually assembled from traditional double-sided PCBS. The outer layer is different from the inner layer, which comprises individual single panels. Before being pressed together, the inner double-layer PCB has undergone the usual production steps, such as drilling, plating, etching, etc.

Usually, based on the production experience of Viasion, the outer layer is drilled with a signal layer. Then the several layers are pressed together to achieve a multi-layer PCB. Viasion has many options for pressing multilayer printed circuit boards, such as hydraulic presses or pressure pods.

If Viasion presses multilayer PCBs with a hydraulic press, preheat first and then place the multi-layer PCB material to be pressed into the preheated pressure. Eventually, it changes the material from a rigid state to a sticky form.

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    Why Choose Viasion as Your Multi-layer PCB Supplier?

    Viasion as a professional multi-layer PCB supplier

    Viasion uses a mature quality management system, marketing management system and after-sales service system to provide customers with high-quality products and professional services.

    Effective quality assurance

    To ensure the excellence of product quality, Viasion not only strictly controls the quality in the selection of materials but also strictly abides by the quality requirements in all aspects of production. After a long period of practice and experience, Viasion has a complete and adequate quality assurance system.

    Leading technologies

    We constantly develop innovative technologies and improve existing ones, aiming to provide our customers with excellent products and services. Our commitment to customer satisfaction has become the core of our culture.

    High-quality services

    For each customer, our company has established a complete service file for follow-up service. In addition, our sales staff constantly strengthens communication and exchange with customers to keep abreast of their needs.

    Applications of Multi-layer PCB

    The following are some of the products that often use multilayer printed circuit boards.

    • GPS and satellite systems
    • industrial controls
    • medical equipments
    • consumer electronics
    • robotics
    • IoTs devices
    • test and measurement
    • telecommunications
    • automotive
    • energy and pwoer
    • computers
    • security electronics

    The Advantages and Disadvantages of Multi-layer PCB

    With the development of society, more and more requirements for technology, so the increase of integrated circuit packaging density, resulting in a high concentration of interconnect, making the use of multi-layer PCB necessary.

    The following are the advantages of multilayer printed circuit boards concluded from Viasion based on production experience, but they also have some potential problems. However, based on years of production experience, Viasion suggests that multi-layer PCBs cost are also higher than single-sided and double-sided PCBs,  such as in design and production.

    Therefore, when designing products according to customer demand, Viasion would choose multi-layer PCBS to meet the demand in such cases. A more extensive layer can enable more circuit layouts, preventing circuits and components. This is the original design aim of multilayer circuit boards to achieve the best possible effect on stability. As a result, Multilayer PCB has a better impact on stability, portability, performance, heat resistance and conductivity. This is because it has made an enormous breakthrough, so it is widely used in various products and fields and continues to maintain an important position, difficult to be replaced.

    Advantages of multi-layer PCB

    Suitable for complex circuits

    Although single PCBs and double layer PCBs are more cost-effective, with the development of science and technology, there are increasingly higher requirements for products. In contrast, the multi-layer board has higher component installation density and smaller volume, perfectly conforming to modern communication equipment products like mobile phones and other complex circuits. If it is a single or double panel, it can hardly meet the requirements in this aspect.

    Better signal transmission speed

    Secondly, the signal transmission speed of the multilayer board is better. As a result, good component layout design, anti-interference, and compatibility will be more outstanding and extensively applied in high-frequency and high-speed products.

    Thicker copper in holes

    Multilayer PCB holes' copper thickness is thicker than regular single and double circuit boards, to achieve high reliability. 

    High reliability

    Regarding multi-layer PCB repair and maintenance, compared with standard single-sided PCB and double-layer PCB, multi-layer PCB is better in reliability and safety. But relative, in use, should pay attention to the use of restrictions if overload carrying will also be damaged.

    Better in component-intensive

    Many advantages of multilayer PCBs are irreplaceable for single and dual panels, especially in the component-intensive aspect. According to the multilayer PCB fabrication experience of Viasion, multi-layer PCBs must be superior to standard single-sided PCB and double-sided PCB in terms of anti-interference and stability.

    Good in design, processing and quality inspection

    That could also help in product design, subsequent processing and quality inspection. As mentioned, more wiring and operable space give multilayer circuit boards more compatibility and anti-interference, making the simple single panel incomparable and alternative. The number of single boards and the double panel is far less than that of multi-layer PCB and is limited.

    Avoid many instability

    However, multilayer circuit board can avoid many instability problems through more number and layout of lines crossing, such as noise generation. In addition, there is interference between components, and so on.

    Disadvantages of multi-layer PCB

    High cost

    The manufacturing process of multi-layer PCB is more complex, as well as it is also difficult to manufacture, so the cost is relatively high.

    Long manufacturing time

    The more layers of the PCB are relatively more time-consuming, and the manufacturing time is longer.

    More advanced equipments are needed

    In multilayer PCB production, more advanced equipment is needed for the smaller drill size and thinner trace width and space on PCBs. Besides, lamination equipment and AOI inspection equipment are a must. So, the multilayer PCB manufacturer must invest more money in the production facility.

    Require high-reliability test methods

    Multilayer PCB manufacturing also requires more sophisticated machines for testing to ensure product quality.

    How Are Multi-layer PCBs Made?

    The following are the brief steps of the manufacturing process.

    1. Front-end tool data preparation: The designer uses a computer-aided design (CAD) system to prepare the PCB layout and create the Gerber file.

    2. Photo plotter is used to create an image of the PCB. This image contains the information used by the machine to print the inner layers of the PCB from the glass fibre core.

    3. Etch the inner layer using an alkaline solution and remove excess copper from the PCB image.

    4. Punch holes to help align the outer and inner layers.

    5. All layers are bonded, and through-holes are drilled in the PCB to connect the copper layers.

    6. Use a thin layer of liquid copper to cover the drilled holes and then plate them.

    7. Etch the outer layer to remove any residual copper. A layer of tin is applied to the top of the liquid copper layer for protection.

    8. Solder mask layers are printed on both sides of the circuit board to protect the copper surface.

    9. The circuit board is formed and cut according to customer requirements.

    10. Next step is printing silkscreen.

    11. The PCBs are tested and inspected before packaging, and all errors are corrected.

    The Origin of Multi-layer PCB

    Multilayer PCB fabrication is evolved from standard single – and double-sided PCBS since PCB’s introduction in 1936. After continuous research and development to meet the more complex and demanding electronic products, the multilayer PCB fabrication was also born in 1961.
    • The emergence of multilayer PCB is essential and inevitable. With the progress of society, the requirements for products are more and more demanding, smaller volume, more dense line and component combination, including higher heat resistance and electrical resistance.
    • Not only in the 20th century but also in the 21st century, according to Viasion, after years of deep cultivation within the range of PCB fabrication and assembly, customers are increasingly becoming demanding of products.
    • Therefore, in the end, under the market demand, the United States and Japan have made significant breakthroughs in the circuit board and finally broke through the single-sided PCB and double-sided PCB. Hazelting Corp, an American company, produced the first multilayer PCB. Subsequently, in the world at the same time, efforts made significant progress and expansion.
    • Compared with the ordinary single-sided PCB and double-sided PCB, the advantages of multi-layer PCB are substantial. Especially in high-tech products, they are widely used in high speed, high frequency, military, aerospace and other products, and the application range is growing.

    Introduction to the Multi-layer PCB Lamination Process

    The lamination process of multilayer PCB fabrication involves stacking several layers of conductive materials connected with vias or tracks. The lamination process helps provide insulation between different layers and protects them from environmental conditions such as moisture, dust and extreme temperatures. It also ensures precise alignment of the various components on each layer for optimal performance.

    The Process Type of Multi-layer PCB

    The high-density interconnect laminated multilayer process, as Viasion has stated, is the product of “light, thin, short, small” and multi-functional hair layers of electronic products. Based on Viasion’s experience in production, including cooperation in technology, some of the more specific mediations are labelled.

    1. First of all, in terms of hole size, the aperture of micro through hole (including blind hole and buried hole) is less than Φ0.1 mm; the Aperture ring ≤ 0.25mm;

    2.he hole density of the micro through hole is more than 600 holes/square inch; Wire width spacing≤0.10 mm;

    3. Cabling density (let the channel grid be 0.05 inches) exceeds 117 inches per square inch. According to the technical index, it is a practical and feasible way to realize PCB high density by using micro-through-hole technology. Therefore, its classification is often divided according to the formation process of the micro-conduction hole:

    • Photoinduced pore-forming multilayer plate technology
    • The lasma etching process for making laminated multilayer plates
    • Jet sandblasting process of pore-forming multilayer board
    • Laser pore-forming multilayer plate technology

    According to Viasion’s experience cooperating with multilayer PCB manufacturing in various fields, high-density interconnect laminated, laminated boards are also commonly categorized. First, high-density interconnect laminated, laminated panels are divided according to the type of medium material:

    1. Use photosensitive materials to create layers of plate,

    2. The manufacture of laminated multi-layer plates with non-sensitive materials.

    1. The electroplating method of micro-through hole interconnection of the laminated multi-layer board.

    2. Laminated multi-layer board with micro through-hole interconnection by conducting adhesive method.

    1. There is a “core board” structure.

    2. No “core plate” structure (no core plate structure is used on the semi-cured sheet.

    Process technology to manufacture high-density interconnects multilayer board). High-density interconnect layer multilayer board is the Japanese IBM company first published in 1991 after several years of development of “surface thin layer circuit multilayer board” manufacturing technology research results, and began to be used in laptop computers. Apps for mobile phones and laptops are now ubiquitous.

    Multi-layer PCB Design

    Viasion is also experienced in the design of multi-layer PCBs. Next, discuss the steps to design multi-layer PCBs and possible action points.
    • The first is to confirm the basic information of multilayer PCB manufacturing. The most basic information is the size of the PCB, the number of layers, thickness and other essential information. But it's also important. This aspect needs to be designed according to the customer's products, and different types of products have additional requirements. The main point to focus on is ensuring the number of layers is symmetrical.
    • Then there is the division and design of components. There are many types of components, including high-signal and low-signal. To avoid interference between components, and to ensure the stability and compatibility of PCBA in the subsequent use, particular components, such as high-signal components and high-heat components, such as IC, should be given priority in the layout of components.
    • After determining the primary value of PCB and the safe layout of components, it is necessary to carry out the line layout. In arranging lines, Viasion follows a rule of using as little wiring as possible on the surface of the veneers so that even if multi-layer PCBS fail due to load or other problems in subsequent use, they can be maximized for repair and maintenance. Excessive wiring on the component surface would discourage maintenance. It's going to be a lot harder.
    • In addition to the layout of the line, it is also necessary to arrange reasonable line parameters according to the positioning and demand of the product, such as the number and thickness of the wiring, including the angle. Viasion follows several principles to maximize PCBA stability and compatibility when designing cabling. First, we should pay attention to the length of the line. If the line design is too long, the relative interference will also be improved, so we must pay attention to the length and wiring angle.
    • Viasion prevents parallel wiring and ensures lines are straight and at the right angles possible. That can further reduce interference between lines. Secondly, the classification principle of different layers should be followed. For example, if we know that there are layers, signal, and power layers in multi-layer PCB, similar layers adjacent should be avoided.
    • Also, when designing the welding pad, pay attention to the size. Viasion will arrange the hole size according to the particularity of the components required by the product, avoiding too large or too small.

    Finally, Viasion has several small tips to improve the overall compatibility and stability of PCBA. For example, in the division and design of components, if IC has a substantial signal, Viasion would usually reduce wiring around the IC and increase a filtering capacitance to minimize interference. In addition, it will reduce the wiring of the signal layer. Otherwise, it will increase instability and interference, affecting the stability of the final product.

    What Is the Purpose of A Multi-layer PCB?

    Multi-layer PCBs have now become a core component of complex electronic circuits. Multi-layer PCBs can be used in large-scale and ultra-large-scale integrated circuits. Multi-layer PCBs rapidly evolve towards high density, high precision and high level of digitization. Thin lines, small aperture penetrations and blind via technology can meet market demand. Multi-layer PCBs play a crucial role in the manufacturing of electronic products due to their flexible design, stable and reliable electrical performance and excellent economic performance.


    The use of multi-layer PCBs is an essential part of modern technology. They offer a reliable and cost-effective way to create complex circuits that can be used in various applications. With the ever-growing demand for more efficient, compact designs, it’s clear that this type of printed circuit board will continue to play an important role in our lives 

    If you need multilayer PCB or require assistance with any other aspect of the process, Viasion has the expertise and experience needed to make sure you get exactly what you need. Contact us today and let us know how we can help bring your project to life!

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    Frequently Asked Questions

    Rigid multi-layer PCB
    Flexible multi-layer PCB
    Rigid-flex multi-layer PCB
    HDI multi-layer PCB
    Buried and blind via multi-layer PCB
    Heavy copper multi-layer PCB
    4-layer PCB, 6-layer PCB, etc.

    The following materials are used to make multi-layer PCBs.
    Core materials
    Copper foil

    The following is a simplified manufacturing process for multi-layer PCBs.
    Inner layer copper trace → lamination → drilling → out layer copper trace → copper plating → solder mask pring → surface treatment → silkcreen printing → profiling →E-test → quality inspection → packaging after cleaning PCB

    The cost of every custom PCB is different. The following factors mainly determine the cost of multi-layer PCBs.
    Base material type
    The dimensions of multi-layer PCBs
    The layer counts
    Copper thickness
    The thickness of the board
    Layup structure
    surface finishes
    Special technology

    Multi-layer PCBs are used in all electronics products, such as industrial controls, automation, robotics, telecommunications, smart phones, smart watches, calculators, TV remote controls, mp3 music players, toys, kitchen appliances, washing machines, electric kettles, e-cigarettes, LED bulbs and energy savers, motherboard, graphics card, power supply, keyboard, computer mouse, graphics processor, image processing circuit, etc.

    The power layer plane should be close to the ground plane and designed to be under the ground plane.
    The wiring layer should be adjacent to the whole metal plane.
    The printed lines in the middle layer form planar waveguides, and the micro-strip lines should be in the surface layer.
    Clock and high-frequency circuits are the primary sources of interference and radiation of multi-layer circuit boards, so they must be arranged separately and away from sensitive circuits.
    Different layers contain different stray and high-frequency radiation currents and routing. Thus, they cannot be treated equally.

    Choosing the right multi-layer PCBs supplier is a helpful way to reduce the cost of multi-layer PCBs. Viasion will offer you high-quality multi-layer PCBs at the most comprising price. So please choose Viasion as your multi-layer PCBs supplier. And we will be your best partner.