High-Quality Multilayer PCBs with Competitive Pricing
What Is A Multilayer PCB?
As the name of multilayer PCB, the difference between multilayer PCB and single and double-sided PCB, in essence, is that their number of layers is not the same. But, of course, multilayer PCB has more layers, and the number of layers of multilayer printed circuit board is in three or more layers.
Viasion has rich experience in production and cooperation, both single panel and dual panel, including multilayer PCB board. They are the same when it comes to connecting circuits.
According to Viasion‘s production experience, most are connected by the through hole on the board unless there are special requirements and circumstances. This is because the production principle of multilayer PCB manufacturing is very different from the traditional production method.
The multi-layer PCB is drilled and electroplated before rolling synthesis. Based on Viasion’s experience, the inner part is usually assembled from traditional double-sided PCBS. The outer layer is different from the inner layer, which comprises individual single panels. Before being pressed together, the inner double-layer PCB has undergone the usual production steps, such as drilling, plating, etching, etc.
Usually, based on the production experience of Viasion, the outer layer is drilled with a signal layer. Then the several layers are pressed together to achieve a multi-layer PCB. Viasion has many options for pressing multilayer printed circuit boards, such as hydraulic presses or pressure pods.
If Viasion presses multilayer PCBs with a hydraulic press, preheat first and then place the multi-layer PCB material to be pressed into the preheated pressure. Eventually, it changes the material from a rigid state to a sticky form.
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Why Choose Viasion as Your Multi-layer PCB Supplier?
Viasion as a professional multi-layer PCB supplier
Effective quality assurance
Applications of Multi-layer PCB
The following are some of the products that often use multilayer printed circuit boards.
The Advantages and Disadvantages of Multi-layer PCB
With the development of society, more and more requirements for technology, so the increase of integrated circuit packaging density, resulting in a high concentration of interconnect, making the use of multi-layer PCB necessary.
The following are the advantages of multilayer printed circuit boards concluded from Viasion based on production experience, but they also have some potential problems. However, based on years of production experience, Viasion suggests that multi-layer PCBs cost are also higher than single-sided and double-sided PCBs, such as in design and production.
Therefore, when designing products according to customer demand, Viasion would choose multi-layer PCBS to meet the demand in such cases. A more extensive layer can enable more circuit layouts, preventing circuits and components. This is the original design aim of multilayer circuit boards to achieve the best possible effect on stability. As a result, Multilayer PCB has a better impact on stability, portability, performance, heat resistance and conductivity. This is because it has made an enormous breakthrough, so it is widely used in various products and fields and continues to maintain an important position, difficult to be replaced.
Advantages of multi-layer PCB
Disadvantages of multi-layer PCB
How Are Multi-layer PCBs Made?
1. Front-end tool data preparation: The designer uses a computer-aided design (CAD) system to prepare the PCB layout and create the Gerber file.
2. Photo plotter is used to create an image of the PCB. This image contains the information used by the machine to print the inner layers of the PCB from the glass fibre core.
3. Etch the inner layer using an alkaline solution and remove excess copper from the PCB image.
4. Punch holes to help align the outer and inner layers.
5. All layers are bonded, and through-holes are drilled in the PCB to connect the copper layers.
6. Use a thin layer of liquid copper to cover the drilled holes and then plate them.
7. Etch the outer layer to remove any residual copper. A layer of tin is applied to the top of the liquid copper layer for protection.
8. Solder mask layers are printed on both sides of the circuit board to protect the copper surface.
9. The circuit board is formed and cut according to customer requirements.
10. Next step is printing silkscreen.
11. The PCBs are tested and inspected before packaging, and all errors are corrected.
The Origin of Multi-layer PCB
Introduction to the Multi-layer PCB Lamination Process
The Process Type of Multi-layer PCB
1. First of all, in terms of hole size, the aperture of micro through hole (including blind hole and buried hole) is less than Φ0.1 mm; the Aperture ring ≤ 0.25mm;
2.he hole density of the micro through hole is more than 600 holes/square inch; Wire width spacing≤0.10 mm;
3. Cabling density (let the channel grid be 0.05 inches) exceeds 117 inches per square inch. According to the technical index, it is a practical and feasible way to realize PCB high density by using micro-through-hole technology. Therefore, its classification is often divided according to the formation process of the micro-conduction hole:
According to Viasion’s experience cooperating with multilayer PCB manufacturing in various fields, high-density interconnect laminated, laminated boards are also commonly categorized. First, high-density interconnect laminated, laminated panels are divided according to the type of medium material:
1. Use photosensitive materials to create layers of plate,
2. The manufacture of laminated multi-layer plates with non-sensitive materials.
1. The electroplating method of micro-through hole interconnection of the laminated multi-layer board.
2. Laminated multi-layer board with micro through-hole interconnection by conducting adhesive method.
1. There is a “core board” structure.
2. No “core plate” structure (no core plate structure is used on the semi-cured sheet.
Process technology to manufacture high-density interconnects multilayer board). High-density interconnect layer multilayer board is the Japanese IBM company first published in 1991 after several years of development of “surface thin layer circuit multilayer board” manufacturing technology research results, and began to be used in laptop computers. Apps for mobile phones and laptops are now ubiquitous.
Multi-layer PCB Design
Finally, Viasion has several small tips to improve the overall compatibility and stability of PCBA. For example, in the division and design of components, if IC has a substantial signal, Viasion would usually reduce wiring around the IC and increase a filtering capacitance to minimize interference. In addition, it will reduce the wiring of the signal layer. Otherwise, it will increase instability and interference, affecting the stability of the final product.
What Is the Purpose of A Multi-layer PCB?
Multi-layer PCBs have now become a core component of complex electronic circuits. Multi-layer PCBs can be used in large-scale and ultra-large-scale integrated circuits. Multi-layer PCBs rapidly evolve towards high density, high precision and high level of digitization. Thin lines, small aperture penetrations and blind via technology can meet market demand. Multi-layer PCBs play a crucial role in the manufacturing of electronic products due to their flexible design, stable and reliable electrical performance and excellent economic performance.
The use of multi-layer PCBs is an essential part of modern technology. They offer a reliable and cost-effective way to create complex circuits that can be used in various applications. With the ever-growing demand for more efficient, compact designs, it’s clear that this type of printed circuit board will continue to play an important role in our lives
If you need multilayer PCB or require assistance with any other aspect of the process, Viasion has the expertise and experience needed to make sure you get exactly what you need. Contact us today and let us know how we can help bring your project to life!
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Frequently Asked Questions
Rigid multi-layer PCB
Flexible multi-layer PCB
Rigid-flex multi-layer PCB
HDI multi-layer PCB
Buried and blind via multi-layer PCB
Heavy copper multi-layer PCB
4-layer PCB, 6-layer PCB, etc.
The following materials are used to make multi-layer PCBs.
The following is a simplified manufacturing process for multi-layer PCBs.
Inner layer copper trace → lamination → drilling → out layer copper trace → copper plating → solder mask pring → surface treatment → silkcreen printing → profiling →E-test → quality inspection → packaging after cleaning PCB
The cost of every custom PCB is different. The following factors mainly determine the cost of multi-layer PCBs.
Base material type
The dimensions of multi-layer PCBs
The layer counts
The thickness of the board
Multi-layer PCBs are used in all electronics products, such as industrial controls, automation, robotics, telecommunications, smart phones, smart watches, calculators, TV remote controls, mp3 music players, toys, kitchen appliances, washing machines, electric kettles, e-cigarettes, LED bulbs and energy savers, motherboard, graphics card, power supply, keyboard, computer mouse, graphics processor, image processing circuit, etc.
The power layer plane should be close to the ground plane and designed to be under the ground plane.
The wiring layer should be adjacent to the whole metal plane.
The printed lines in the middle layer form planar waveguides, and the micro-strip lines should be in the surface layer.
Clock and high-frequency circuits are the primary sources of interference and radiation of multi-layer circuit boards, so they must be arranged separately and away from sensitive circuits.
Different layers contain different stray and high-frequency radiation currents and routing. Thus, they cannot be treated equally.
Choosing the right multi-layer PCBs supplier is a helpful way to reduce the cost of multi-layer PCBs. Viasion will offer you high-quality multi-layer PCBs at the most comprising price. So please choose Viasion as your multi-layer PCBs supplier. And we will be your best partner.