Although most of PCBs are produce and assembled as IPC-A-600/IPC-A-610 Class 2, such as consumer electronics, computer peripherals, telecommunication & wireless, IoTs, robotics, LED & lighting, test & measurement, industrial controls. But for same special area, IPC-A-600/IPC-A-610 Class 3 must be applied, such as automotive, medical, military, aeronautics, life support systems., etc. Military and aeronautics even requires IPC Class 3/A which is a higher standard than Class 3.
Here in Viasion, we can supply PCBs produced according to IPC Class 3 and IPC Class 3/A, to meet the highest standard in PCB industrial.
The main acceptance criteria for IPC-A-600 Class 3 PCBs
- The minimum copper plating thickness in PTH wall are different:

IPC Class 2 PCB acceptance criteria: PTH wall thickness>=20 um.
IPC Class 3 PCB acceptance criteria: PTH wall thickness>=25 um.
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- Minimum ring of PTH:

IPC Class 2 PCB acceptance criteria: Broken ring at 90 °or less.
IPC Class 3 PCB acceptance criteria: Min. Ring size: 0.05mm.
- Copper conductor width

IPC Class 2 PCB acceptance criteria: Gap not over 30% of the minimum wire spacing
IPC Class 3 PCB acceptance criteria: Gap not over 20% of the minimum wire spacing
- Hole wall copper plating voids:

IPC Class 2 PCB acceptance criteria: Cavity inside the hole wall acceptable under certain conditions.
IPC Class 3 PCB acceptance criteria: Not accept any cavity inside the hole wall.
- Soda strawing in solder mask:

IPC Class 2 PCB acceptance criteria: Straw gap acceptable under certain conditions.
IPC Class 3 PCB acceptance criteria: Straw gap is not allowed.
- Maximum wicking allowed in copper plating.

IPC Class 2 PCB acceptance criteria: Wicking not over 100 um.
IPC Class 3 PCB acceptance criteria: Wicking not over 80 um.
The main acceptance criteria for IPC-A-610 Class 3 PCB Assembly
- Hole wall filling by tin in PTH holes

IPC Class 2 PCB assembly acceptance criteria: Hole wall filling amount over 50%.
IPC Class 3 PCB assembly acceptance criteria: Hole wall filling amount over 75%.
- Wetting on SMT components

IPC Class 2 PCB assembly acceptance criteria: tin is evident on the vertical surface of the SMD components
IPC Class 3 PCB assembly acceptance criteria: min. Fillet height is 0.5mm, or 25 % solder + SMD component height
- Side overhang on SMD components

IPC Class 2 PCB assembly acceptance criteria: side overhang less than 50% of the component/pad area
IPC Class 3 PCB assembly acceptance criteria: side overhang less than 25% of the component/pad area
- End joint width on SMD pads

IPC Class 2 standard: end joint width is min. 50% of the SMD component/PAD
IPC Class 3 standard: end joint width is min. 75% of the SMD component/PAD
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Viasion Technology is your trusted partner & one-stop shop for PCB fabrication, components sourcing, PCB assembly and electronic manufacturing. With more than 16 years of experience, we have been supplying high-quality PCBs with competitive pricing for 1000+ customers worldwide. Our company is ISO9001:2015 Certified & UL Listed, and all our products are 100% E-tested and inspected by AOI & X-RAY to meet the highest industry standards. So please get an instant quote from our sales team now, and we will take care of the rest.