CAD:
See Computer-Aided Design.
CAM:
See Computer-Aided Manufacturing.
Chamfer:
A broken corner to eliminate an otherwise sharp edge.
Circuit:
The interconnection of a number of devices in one or more closed paths to perform a desired electrical or electronic function.
Circuitry Layer:
A layer of a printed board containing conductors, including ground and voltage planes.
Cleanroom:
A room in which the concentration or airborne particles is controlled to specified limits.
Component:
An electronic device, typically a resistor, capacitor, inductor, or integrated circuit (IC), that is mounted to the circuit board and performs a specific electrical function.
Component Hole:
A hole used for the attachment and electrical connection of a component termination, such as a pin or wire to the circuit board.
Component Side:
The side of the circuit board on which most of the components will be located. Also called the “top side.”
Computer-Aided Design (CAD):
A software program with algorithms for drafting and modeling, providing a graphical representation of a printed board’s conductor layout and signal routes.
Computer-Aided Manufacturing (CAM):
The use of computers to analyze and transfer an electronic design (CAD) to the manufacturing floor.
Computer-Integrated Manufacturing (CIM):
Software that takes assembly data from a CAD or CAM package and, using a pre-defined factory modeling system, outputs routing of components to machine programming points and assembly and inspection documentation.
Conductor:
A thin conductive area on a PCB surface or internal layer usually composed of lands (to which component leads are connected) and paths (traces).
Conductor Spacing:
The distance between adjacent edges (not centerline to centerline) of isolated conductive patterns in a conductor layer.
Conductor Thickness:
The thickness of the conductor including all metallic coatings.
Conformal Coating:
An insulating protective coating that conforms to the configuration of the object coated and is applied on the completed board assembly.
Connector Area:
The portion of the circuit board that is used for providing electrical connections.
Controlled Impedance:
The matching of substrate material properties with trace dimensions and locations to create specific electric impedance as seen by a signal on the trace.
Core Thickness:
The thickness of the laminate base without copper.