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What is IC Substrate& IC Substrate PCB?
IC substrate is a substrate used to package bare IC (integrated circuit) chips. It is used as an IC carrier to provide signal interconnection between the chip and PCB, heat dissipation channel, and chip protection. IC substrate PCB is a high-end PCB, and its primary function is to serve as a carrier to carry ICs and to connect the signals between the chip and the printed circuit board with lines inside the IC carrier.
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Classifications of IC Substrate
The Properties of IC Substrate PCB
Applications of IC Substrate PCB
Why Choose Viasion as Your IC Substrate PCB Supplier
Benefits of Using IC Substrate printed circuit board
Viasion summarizes the following benefits of using IC substrate PCBs.
- Integrated Circuit Substrate PCB are lightweight, providing better energy efficiency and performance.
- They offer improved electrical characteristics, including high-speed signal integrity.
- IC Substrate printed circuit boards use thinner copper traces than traditional circuit boards resulting in higher-density designs.
- They provide a more reliable connection due to their reduced size and weight.
- IC Substrate printed circuits enable the design of smaller form factor devices with extra features and functionality.
- They allow faster production times due to shorter wire lengths and fewer solder joints.
IC Substrate PCB Design Process
As Viasion’s engineers suggest, the design process of IC substrate PCBs starts with understanding the specific requirements of the IC chip and its integration into the IC package. Then, according to Viasion’s experience, designers must create a detailed layout that includes all components, such as resistors, capacitors, transistors, inductors and any other necessary ICs. What’s more, the IC package substrate PCB must be designed to accommodate the IC package and its specific dimensions so that it will fit perfectly. Lastly, the IC Substrate board must also be designed to ensure proper heat dissipation, given that IC chips generate considerable heat during operation. Once the layout of all components has been completed and their position verified, the integrated Circuit Substrate PCB is sent for fabrication.
There is no doubt that IC substrate PCB design is essential to ensure the reliable production of IC devices. The success of IC device manufacturing can’t be achieved without successful IC Substrate board designs. Through careful consideration and detailed layout plans, IC device designers can create functional IC substrates that meet IC device requirements.
Manufacturing Difficulties of IC Substrate PCB
Manufacturing Process of IC Substrate PCB
IC Substrate Testing
IC substrate testing is a form of electronic testing used to inspect IC (Integrated Circuit) substrates for any defects or damage. IC substrate testing is often done before final assembly or after the IC has been mounted to the board. When ICs are mounted on a board, they are usually tested using automated testing equipment, which helps identify any potential issues with the ICs before installation and final assembly of the IC substrate PCB. IC substrate testing can also detect problems that may arise during operation and check for proper communication between ICs on a board. Without the IC substrate testing, it’s impossible to ensure that all components of an IC are in perfect working order before being put into use.
The main IC substrate testing methods are as follows.
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Frequently Asked Questions
According to the material, it can be divided into: Rigid, flexible, ceramic, polyimide, BT, etc.
According to the technology, it can be divided into: BGA, CSP, FC, MCM, etc.
IC substrates require considerable expertise and skill to fabricate, as they contain several layers of complex wiring, components, and IC packages.
In addition, IC substrates are often expensive to manufacture due to their complexity.
Finally, IC substrates are also prone to failure due to their small size and complex wiring.
IC substrate PCBs differ from standard PCBs in that they are specifically designed to support IC chips and IC-packaged components. As for PCB production aspect, IC Substrate Manufacturing is much difficulty than standard PCB because of it’s high density drill and trace.
Yes, an IC package substrate PCB can be used for prototyping.
The biggest challenging is very high density drill such as 0.1 mm blind vias and buried vias, stacked micro via is very common in integrated circuit substrate PCBs manufacturing. And the trace space and width can be as small as 0.025 mm. So it is very critical to find trusted IC substrate factories for such kind of printed circuit boards.