What is Any Layer PCB and How Is it Produced?

Any Layer PCBs Stackup

Since High Density Interconnect (HDI) print circuit boards feature thin connections, small spaces, and high wire density, these features allow fast and reliable connection and reduce the size of the project to be produced to a small size with high operating efficiency. All of this makes it at the forefront of the advanced and modern PCB industry. HDI PCBs are known to have blind, buried, and microvias which are laser engraved and sequential lamination processes. It is generally known that all these processes produce HDI PCBs and this is what makes them different from regular Print Circuit Boards (PCBs).

Although HDI PCBs have made a significant and influential move in the electronics industry, especially in reducing the size of integrated electronic circuits. Since the development in the electronic industries is increasing day after day, this in turn has led to the development of the HDI PCBs industry, thus creating more types of HDI to suit the requirements of the electronic project industry, which is constantly growing and developing rapidly.

What is Any Layer PCB?

There are several types of HDI, and they are divided based on how the vais are placed and oriented between the different layers, as well as according to the purpose of manufacturing and the number of layers, in other words, according to the requirements of the project.

Vias of HDI PCBs

Before embarking on any concept, we want to clarify in general what vais are. They are small holes that work to connect signals between layers, and this is what characterizes HDI PCBs. It can be expressed in these boards in four different ways, which are buried vais, blind vais, hole vais, and microvia. As mentioned earlier, together they form the HDI PCBs.

Since HDI PCBs can combine multiple layers in different ways depending on what the project needs, this has resulted in several common types of HDI stacks including, 1+N+1, 2+N+2, 3+N+3, any layer PCB, but we will focus mainly on one type and learn about it in general, so what is any layer PCB, and how is it produced.

Any Layer HDI PCBs, which can also be called Every Layer Interconnect (ELIC), is one of the developments that has improved the manufacturing technology of HDI PCBs. There are several layers of HDI, so these layers are interconnected with each other in a high-density manner, and each of these layers has high connectivity, that is, they communicate with each other completely and freely, hence the name Every Layer Interconnect, through many of microvias It is present in each layer separately, as the following image shows.

HDI PCB with Any Layer Vias

Advantages of Any Layer PCB

The process of microvias engraving through the use of laser makes any layer of PCB board more efficient, reliable and highly accurate in processing. Since they contain denser wires, they have greater density and functionality, they also have greater freedom in design as the designer is not limited to a specific number of paths, and they certainly help in an efficient and working way in reducing the size of the electronic devices produced.

Therefore, we find any layer PCB widely used in the manufacture of smart devices such as smartphones, which now require a smaller, thinner size and high efficiency in performing functions. Since it works to connect the layers, we find that it improves the signal and strengthens performance. Therefore, any layer PCB is also used in smart displays, laptops, communication networks such as the 4G and 5G in particular, and many applications in the fields of hardware, military, etc.

How is Any Layer PCB Produced?

Any layer PCB can be produced by building layers of HDI individually, so that these layers are stacked. The production process usually begins with the inner layer, which is a solid layer of copper, each layer is isolated from the other and surrounds the sides of the core separately. After that, Microvias are drilled on each layer and then filled. Filling is usually done with copper pastes. After that, the insulating layer is added during the plating process, and then a new microvia is made and filled. This process is repeated continuously and then pressing all the layers and exposing them to heat until any stacked PCB layer is built.

10 Layer Any Layer PCB

Note that we do not place them one after the other as is the case in a regular PCB, but rather each part is formed based on the HDI guidance individually and after that, it is packaged together as one set. with each construction process, a successive microvia is created that improves the efficiency of any layer PCB board. Keep in mind that the aspect ratio of the microvias must be determined because it greatly affects the reliability and efficiency of the panel produced.

In conclusion, HDI PCBs manufacturing techniques have contributed greatly and widely to the electronic industries, as they are characterized by high density, making them the first contributor to the miniaturization of electronic industries and electrical circuits. This applies to any layer PCB, it worked on changing and developing HDI PCBs stacks, and they have also become an indispensable part of the manufacture of smart and high-speed devices, mainly in the developments of 5G and IOT network technology, and largely in smartphones. But there is no escape from the fact that it requires a cost in the process of production and design, but certainly in exchange for this high cost, what is obtained is a product that is efficient and reliable and performs many functions quickly and with high processing.

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