The difference between reflow soldering and wave soldering in PCBA processing

Views:4     Author:Site Editor     Publish Time: 2021-05-24      Origin:Site Inquire

  In PCBA processing, two common soldering methods are reflow soldering and wave soldering. So in PCBA processing, what is the role of reflow soldering, what is the role of wave soldering, and what is the difference between them? Next, Shenzhen PCBA processing manufacturer-Shenzhen VIASION Electronic Technology Co., Ltd. will introduce the difference between reflow soldering and wave soldering in PCBA processing.

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  The main difference between reflow soldering and wave soldering in PCBA processing is that wave soldering is mainly used to solder plug-in components, and reflow soldering is mainly used to solder patch-type components. The specific differences are as follows:

 

  1. SMT reflow soldering process

  In simple terms, reflow soldering is used in chip component placement, referred to as smt placement. It first prints the solder paste on the PCB pads, and then uses the placement machine to mount the components on the solder paste printed pads. Then the solder paste is melted through a reflow oven, and then cooled and solidified. A process that connects the solder ends or pins of the components with the PCB pads and energizes them. Referred to as reflow soldering.

 

  SMT products have the advantages of compact structure, small size, vibration resistance, impact resistance, good high frequency characteristics, and high production efficiency. SMT reflow soldering has occupied a position in the circuit board assembly process.

 

  2. DIP wave soldering process

  In short, wave soldering is the soldering method of plug-in materials, referred to as DIP soldering. Its process requirement is to first insert the plug-in material into the corresponding soldering hole, and then send the circuit board into the pre-melted soldering furnace through the furnace fixture, and the melted solder passes through a mechanical pump or an electromagnetic pump The jet flow forms the solder wave crest, and the solder joint of the plug-in material melts into the pore through the wave summit. After cooling and solidification, the plug-in material pin and the via hole are soldered to achieve electrical performance. Abbreviation: wave soldering.

 

  At present, the coexistence of reflow soldering and wave soldering is common in the design of smart products, which is also a starting point for the mixed assembly process requirements in smt chip processing. Both processes are available in SMT chip manufacturers.


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