PCBA processing requirements for PCB boards

Views:2     Author:Site Editor     Publish Time: 2021-08-14      Origin:Site Inquire

  During PCBA processing, there will be many special processes, which will immediately bring restrictions on the PCB board. If the PCB board does not meet the requirements, it will increase the difficulty of the PCBA soldering process, which may eventually lead to soldering defects and the board is not Qualified, etc. Therefore, in order to ensure the smooth completion of the special process and to facilitate the PCBA processing, the PCB board must meet the manufacturability requirements in terms of size and pad distance. Next, Shenzhen PCBA processing manufacturer-Shenzhen Viasion Electronics will introduce to you PCBA processing requirements for PCB boards.

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  PCBA processing requirements for PCB boards

  1. PCB size

      The width of the PCB (including the edge of the board) should be greater than 50mm and less than 460mm, and the length of the PCB (including the edge of the board) should be greater than 50mm. If the size is too small, it needs to be made into a jigsaw.

 

  2. PCB board edge width

      Board edge width: >5mm, panel spacing: <8mm, distance between pad and board edge: >5mm

 

  3. PCB bending

      Upward bending degree: <1.2mm, downward bending degree: <0.5mm, PCB distortion: maximum deformation height ÷ diagonal length <0.25

 

  4. PCB board mark point

      Mark shape: standard circle, square, triangle;

      Mark size: 0.8~1.5mm;

      Mark material: gold-plated, tin-plated, copper and platinum;

      Mark's surface requirements: the surface is flat, smooth, non-oxidized, and free of dirt;

      Mark's surrounding requirements: there should be no green oil or other obstacles within 1mm, which is obviously different from the Mark's color;

      Mark position: 3mm above the edge of the board, and there should be no Mark-like vias, test points, etc. within 5mm around the board.

 

  5. PCB pads

      There are no through holes on the pads of SMD components. If there is a through hole, the solder paste will flow into the hole, resulting in less tin in the device, or the tin flowing to the other side, causing the board surface to be uneven and the solder paste cannot be printed.

When conducting PCB design and production, it is necessary to understand some knowledge of PCBA welding process, so as to make the product suitable for production. Understanding the requirements of the processing plant first can make the subsequent manufacturing process more smooth and avoid unnecessary troubles.

 

  This is the requirement of PCBA processing for PCB boards. We should not slacken in the production of PCB boards. Only by producing high-quality and compliant PCB boards can the boards better accept other special processes.


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