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Experienced employees, state-of-the-art technologies, professional appliances and used quality management system ISO 9001:2015 ensure that the PCBs offered by Viasion are at the highest global level.
Viasion supply a wide range of PCB technologies; please refer to Our PCB production capability as following:
                                                   Items                          Capability
Material type FR4 FR4, High TG FR4, Halogen free FR4, high speed FR4
Polymide Dupont Pyralux AP/TK series, Panasonic "FELIOS" series
Metal based Aluminum based, Copper based,  special alloys based,
Laird 1KA04,1KA06, Bergquist MP06503, HT0450
Microwave & RF Rogers RO4350, RO4003, RO3003, RT/duroid, Arlon 85N, 33N,
Nelco N4000-13, Panasonic Megtron 4,Megtron 6,
Taconic RF35, TUC TU872, EMC EM827
Feature Layers counts 1-40 layers 
Board thickness 0.13-7.0mm
max. board size 21×59 inch
Layup blind/buried vias mechanical drill, laser drill, stacked vias available
HDI i+N+i(i>=1),epoxy fill, copper fill,electrochemical plating
Surface finish Surface treatment HAL with lead, lead free HAL, flash gold, ENIG, immersion silver,
immersion tin, OSP, hard gold plating, hard gold connector,
ENEPIG, peelable mask, carbon ink, silver ink
Drill max. Aspect ratio Max aspect ratio: 16:1(drill >=0.2mm)
min. drill position tolerance ±2mil
PTH tolerance ±3mil
press fit hole tolerance ±2mil
NPTH tolerance ±2mil
min. drill mechanical drill: 0.15mm; laser drill: 0.1mm
back drill size 0.5-6.5mm
slot tolerance ±0.15mm
PAD min. pad for laser drill 10mil
min. pad for mechanical drill 14mil
BGA pad >=7mil
min. PAD tolerance   +5%;  -10%
Min. trace width/clearance        inner layers 1/3,1/2OZ:3/3mil
1OZ:3/4 mil
2OZ:5/5 mil
3OZ:6/7 mil
4OZ:7/11 mil
5OZ:10/16 mil
out layers 1/3OZ:3/3 mil
1/2OZ:3.5/3.5 mil
1OZ:4.5/5 mil
2OZ:6/8 mil
3OZ:8/14 mil
4OZ:10/16 mil
5OZ:12/20 mil
tolerance <=10mil: ±1.0mil
Min. spacing drill to trace (blind/buried via) 9mil( 2 or 3 time pressing)
drill to trace (no blind/buried via) 6mil(<= 8 layer), 8mil(<=  14 layer), 9mil(<=  28 layer)
laser drill to trace(1-3 times pressing)          6mil
outline to trace 8mil
V-CUT line to trace (mm) H<= 1.0mm:0.3(20°),0.33(30°),0.37(45°),0.42(60°)
1.0<H<= 1.6mm:0.36(20°),0.4(30°),0.5(45°),0.6(60°)
1.6<H<= 2.4mm:0.42(20°),0.51(30°),0.64(45°),0.8(60°)
2.5<H<= 3.0mm:0.47(20°),0.59(30°),0.77(45°),0.97(60°)
inner layer copper separate spacing 8mil
outline to inner layer copper 8mil
chamfer to gold finger 7mil
PAD to PAD distance (ENIG) 4mil
spacing between gold fingers 6mil
PAD to PAD distance (HAL) 7mil (to main copper 10mil)
peelbale mask to PAD 16mil
silkscreen to PAD 6mil
between carbon ink 15mil
Others min. distance between inner layers 2mil(without blind/buried via); 5mil(with blind/buried via)
layer to layer misalignment <= 5mil
board thickness tolerance board thickness<= 1.0mm: ±0.1mm
board thickness>1.0mm: ±10%
special(no layup requirement):thickness <= 2.0mm ±0.1mm;
thickness 2.1-3.0 ±0.15mm
impedance tolerance ±5Ω(<50Ω),±10%(>= 50Ω);>=50Ω max.±5%
outline tolerance ±0.13mm, max. +/-0.1mm
outline position tolerance ±0.1mm
bow & twist 0.7%, max.0.1%
max. inner layer copper thickness 10 OZ
max. inner layer copper thickness 15OZ
min prepreg thickness 2mil(0.5oz copper)
min silkscreen width and height width: 4mil; height: 20mil
min. inner radius 0.3mm
min.V-CUT angle tolerance ±5°
min.V-CUT symmetry tolerance ±4mil
min.V-CUT remaince tolerance ±4mil
min solder mask dam 4mil(green),5mil(other color)(base cu<=1OZ)
(cu thickness 2-4OZ,need 6mil)
solder mask color green, black, blue, red, white, grey, purple
silkscreen color white, black, yellow,green
min chamfer angle tolerance ±5°
min chamfer remaince tolerance ±5mil
Max. e-testing voltage 500V
Max. e-testing current 200mA

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