Viasion Technology is committed to offering the highest quality printed circuit boards at the most competitive pricing. We aim to provide customer excellence on all orders whether you need a simple prototype, mass production or a time-critical and technologically complex multi-layer printed circuit board product. We manufacture based on IPC guidelines and complies with ISO9001:2015 and RoHS/REACH standards.
Viasion manufactures PCBs with various materials including conventional FR4, high TG FR4, high frequency/high speed FR4, halogen free FR4, polyimide, high thermal conductive CEM3, aluminium/copper base, PTFE etc. PCB surface finish includes HASL,ENIG, OSP, immersion gold/tin/silver, hard gold plating, carbon ink, blue mask,
ENEPIG.
PCB Capabilities:
PCB Types
- Rigid, Flex and Rigid Flex
- Blind / Buried Vias, Micro Vias, Any-Layer HDI
- Via In Pad, Conductive & Non Conductive
- Aluminum based, Copper based
- Microwave & RF
- Impedance Control
- Backplane, back drill
- Heavy Copper 20 oz
- IC Substrate PCB
Type of Material
- FR4: High TG FR4, Halogen free FR4, High Speed FR4
- Polymide: Dupont Pyralux AP/TK series, Panasonic "FELIOS" series
- Metal based: Aluminum based, Copper based, special alloys based Laird 1KA04,1KA06, Bergquist MP06503, HT0450
- Microwave & RF: Rogers RO4350, RO4003, RO3003, RT/duroid, Arlon 85N, 33N,Nelco N4000-13, Panasonic Megtron 4, Megtron 6, Taconic RF35, TUC TU872, EMC EM827
Surface finishes
Immersion Gold (ENIG)
Immersion Silver
Immersion Tin
ENEPIG
Pb-Free HAL
OSP
Hard Gold Plating
Soft Gold
Selective Finishes
Turnaround time
Quick turn: 1-5 days
Prototype and mall series production: 1-2 weeks
Mass production: 2-4 weeks
Others
Layers counts 1-40 layers, upto 100 layers for special
Board thickness 0.13-7.0mm
Max. board dimensions: 21×59 inch
Max aspect ratio: 16:1(drill >=0.2mm)
Solder mask color: green, black, blue, red, white, grey, purple
Silkscreen color: white, black, yellow,green
Outline method: Routing, v-cut and punching by mold
