| Items | Capability | |
| Material type | FR4 | FR4, High TG FR4, Halogen free FR4, high speed FR4 |
| Polymide | Dupont Pyralux AP/TK series, Panasonic "FELIOS" series | |
| Metal based | Aluminum based, Copper based, special alloys based, Laird 1KA04,1KA06, Bergquist MP06503, HT0450 | |
| Microwave & RF | Rogers RO4350, RO4003, RO3003, RT/duroid, Arlon 85N, 33N, Nelco N4000-13, Panasonic Megtron 4,Megtron 6, Taconic RF35, TUC TU872, EMC EM827 | |
| Feature | Layers counts | 1-40 layers |
| Board thickness | 0.13-7.0mm | |
| max. board size | 21×59 inch | |
| Layup | blind/buried vias | mechanical drill, laser drill, stacked vias available |
| HDI | i+N+i(i>=1),epoxy fill, copper fill,electrochemical plating | |
| Surface finish | Surface treatment | HAL with lead, lead free HAL, flash gold, ENIG, immersion silver, immersion tin, OSP, hard gold plating, hard gold connector, ENEPIG, peelable mask, carbon ink, silver ink |
| Drill | max. Aspect ratio | Max aspect ratio: 16:1(drill >=0.2mm) |
| min. drill position tolerance | ±2mil | |
| PTH tolerance | ±3mil | |
| press fit hole tolerance | ±2mil | |
| NPTH tolerance | ±2mil | |
| min. drill | mechanical drill: 0.15mm; laser drill: 0.1mm | |
| back drill size | 0.5-6.5mm | |
| slot tolerance | ±0.15mm | |
| PAD | min. pad for laser drill | 10mil |
| min. pad for mechanical drill | 14mil | |
| BGA pad | >=7mil | |
| min. PAD tolerance | +5%; -10% | |
| Min. trace width/clearance | inner layers | 1/3,1/2OZ:3/3mil |
| 1OZ:3/4 mil | ||
| 2OZ:5/5 mil | ||
| 3OZ:6/7 mil | ||
| 4OZ:7/11 mil | ||
| 5OZ:10/16 mil | ||
| out layers | 1/3OZ:3/3 mil | |
| 1/2OZ:3.5/3.5 mil | ||
| 1OZ:4.5/5 mil | ||
| 2OZ:6/8 mil | ||
| 3OZ:8/14 mil | ||
| 4OZ:10/16 mil | ||
| 5OZ:12/20 mil | ||
| tolerance | <=10mil: ±1.0mil | |
| >10mil:±1.5mil | ||
| Min. spacing | drill to trace (blind/buried via) | 9mil( 2 or 3 time pressing) |
| drill to trace (no blind/buried via) | 6mil(<= 8 layer), 8mil(<= 14 layer), 9mil(<= 28 layer) | |
| laser drill to trace(1-3 times pressing) | 6mil | |
| outline to trace | 8mil | |
| V-CUT line to trace (mm) | H<= 1.0mm:0.3(20°),0.33(30°),0.37(45°),0.42(60°) | |
| 1.0<H<= 1.6mm:0.36(20°),0.4(30°),0.5(45°),0.6(60°) | ||
| 1.6<H<= 2.4mm:0.42(20°),0.51(30°),0.64(45°),0.8(60°) | ||
| 2.5<H<= 3.0mm:0.47(20°),0.59(30°),0.77(45°),0.97(60°) | ||
| inner layer copper separate spacing | 8mil | |
| outline to inner layer copper | 8mil | |
| chamfer to gold finger | 7mil | |
| PAD to PAD distance (ENIG) | 4mil | |
| spacing between gold fingers | 6mil | |
| PAD to PAD distance (HAL) | 7mil (to main copper 10mil) | |
| peelbale mask to PAD | 16mil | |
| silkscreen to PAD | 6mil | |
| between carbon ink | 15mil | |
| Others | min. distance between inner layers | 2mil(without blind/buried via); 5mil(with blind/buried via) |
| layer to layer misalignment | <= 5mil | |
| board thickness tolerance | board thickness<= 1.0mm: ±0.1mm | |
| board thickness>1.0mm: ±10% | ||
| special(no layup requirement):thickness <= 2.0mm ±0.1mm; thickness 2.1-3.0 ±0.15mm | ||
| impedance tolerance | ±5Ω(<50Ω),±10%(>= 50Ω);>=50Ω max.±5% | |
| outline tolerance | ±0.13mm, max. +/-0.1mm | |
| outline position tolerance | ±0.1mm | |
| bow & twist | 0.7%, max.0.1% | |
| max. inner layer copper thickness | 10 OZ | |
| max. inner layer copper thickness | 15OZ | |
| min prepreg thickness | 2mil(0.5oz copper) | |
| min silkscreen width and height | width: 4mil; height: 20mil | |
| min. inner radius | 0.3mm | |
| min.V-CUT angle tolerance | ±5° | |
| min.V-CUT symmetry tolerance | ±4mil | |
| min.V-CUT remaince tolerance | ±4mil | |
| min solder mask dam | 4mil(green),5mil(other color)(base cu<=1OZ) (cu thickness 2-4OZ,need 6mil) | |
| solder mask color | green, black, blue, red, white, grey, purple | |
| silkscreen color | white, black, yellow,green | |
| min chamfer angle tolerance | ±5° | |
| min chamfer remaince tolerance | ±5mil | |
| Max. e-testing voltage | 500V | |
| Max. e-testing current | 200mA | |
