See Computer-Aided Design.
See Computer-Aided Manufacturing.
A broken corner to eliminate an otherwise sharp edge.
The interconnection of a number of devices in one or more closed paths to perform a desired electrical or electronic function.
A layer of a printed board containing conductors, including ground and voltage planes.
A room in which the concentration or airborne particles is controlled to specified limits.
An electronic device, typically a resistor, capacitor, inductor, or integrated circuit (IC), that is mounted to the circuit board and performs a specific electrical function.
A hole used for the attachment and electrical connection of a component termination, such as a pin or wire to the circuit board.
The side of the circuit board on which most of the components will be located. Also called the “top side.”
Computer-Aided Design (CAD):
A software program with algorithms for drafting and modeling, providing a graphical representation of a printed board’s conductor layout and signal routes.
Computer-Aided Manufacturing (CAM):
The use of computers to analyze and transfer an electronic design (CAD) to the manufacturing floor.
Computer-Integrated Manufacturing (CIM):
Software that takes assembly data from a CAD or CAM package and, using a pre-defined factory modeling system, outputs routing of components to machine programming points and assembly and inspection documentation.
A thin conductive area on a PCB surface or internal layer usually composed of lands (to which component leads are connected) and paths (traces).
The distance between adjacent edges (not centerline to centerline) of isolated conductive patterns in a conductor layer.
The thickness of the conductor including all metallic coatings.
An insulating protective coating that conforms to the configuration of the object coated and is applied on the completed board assembly.
The portion of the circuit board that is used for providing electrical connections.
The matching of substrate material properties with trace dimensions and locations to create specific electric impedance as seen by a signal on the trace.
The thickness of the laminate base without copper.