Viasion provides PCB assembly services in both leaded and RoHS processes,including:
Plated Thru-Hole Assembly
SMT assembly including BGA Assembly, smallest placement: 0201
Using traditional methods, Viasion staff carry out manual assembly of conventional technology PCBs in prototype, small volumes. Supported by modern equipment, Viasion can supply medium and large volumes assembly, and can work many surface mount packages including BGA, Chip Scale Packages and passives down to 0201, a high level of placement accuracy, solder joint integrity and quality is consistently achieved.
1. Through hole board assembly Our Thru-hole assembly process allows for your parts to be hand prepped, loaded and inspected on an assembly line after which they are either wave-soldered or hand soldered. All assembled boards then go through final inspection, ensuring the highest quality before delivery to you.
2. SMT assembly We use Juki and Panasonic assembly line for SMT assembly. Our SMT assembly capability is:
Component height: 0.2-25 mm
Min. Package: 0201
Min distance among BGA : 0.25-2.0 mm
Min. BGA size: 0.1-0.63 mm
Min. QFP Space: 0.35 mm
Min. assembly size: (X*Y): 50*30 mm
Max. assembly size: (X*Y): 350*550 mm
Pick-Placement precision:±0.01 mm
Pick-Placement range: QFP, SOP, PLCC, BGA
Placement capability: 0805,0603,0402,0201
Via in Pad, Blind & Buried Vias capable
Rigid, Flex, Rigid flex capable
High pin count press fit capable
SMT capacity per day: 3,000,000 point
3. Cable assembly We also make cable assembly to fulfill our customer's requirement sometimes. If customers need special or complicated cables, we can use our professional cable assembly partners to produce.