Viasion provides PCB assembly services in both leaded and RoHS processes, including: plated thru-Hole, SMT, and BGA. Using traditional methods and the latest equipment and processes, our trained staff can supply prototype through to large volume assembly. We can place many surface mount packages including BGA, Chip Scale Packages and passives down to 0201. A high level of placement accuracy, solder joint integrity and quality is consistently achieved.
1. Through hole board assembly Our Thru-hole assembly process allows for your parts to be hand prepped, loaded and inspected on an assembly line after which they are either wave-soldered or hand soldered. All assembled boards then go through final inspection, ensuring the highest quality before delivery to you.
2. SMT assembly
Component height: <=65 mm Min. Package: 01005 & 02015 Min. assembly size: (X*Y): 50*30 mm
Max. assembly size: (X*Y): 700*460 mm Pick-Placement precision:±0.03 mm Pick-Placement range: QFP, SOP, PLCC, BGA Via in Pad, Blind & Buried Vias capable Rigid, Flex, Rigid flex capable High pin count press fit capable SMT capacity per day: 3,000,000 point
3. Cable assembly We also make cable assembly to fulfill our customer's requirement sometimes. If customers need special or complicated cables, we can use our professional cable assembly partners to produce.