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PCB Assembly of Mini-PC features RK3568 for IOT applications

Through hole board assembly
SMT assembly including BGA, QFN and 0201 chips
Material procurement
Consigned material management
Functional test
IOT Applications: Mini-PC features RK3568, dual GbE, PoE+, and WiFi 6
Availability:
Quantity:
  • Services and Applications:

    • Through hole board assembly

    • SMT assembly including BGA Assembly, smallest placement: 0201

    • Material procurement

    • Consigned material management

    • Plastic or metal enclosure

    • Complex final assembly

    • Functional test

    • Cable assembly

    • Labeling and Packaging

    • Customized logistics per customer

    • Laser cut framed SMT solder paste stencils

    • PCB design and schematic capture

    • Applications: UPS backup power


  • PCBA Capabilities:

    • Component height: 0.2-25mm

    • Min. package: 0201

    • Min distance among BGA : 0.25-2.0mm

    • Min. BGA size: 0.1-0.63mm

    • Min. QFP space: 0.35mm

    • Min. assembly size: (X*Y): 50*30mm

    • Max. assembly size: (X*Y): 500*650mm

    • Pick-placement precision: ±0.01mm

    • Pick-placement range: QFP,SOP,PLCC,BGA

    • Placement capability: 0805,0603,0402,0201

    • High pin count press fit available

    • SMT capacity per day: 3,000,000 point per day


  • Competitive advantage:

    • Good pricing

    • No MOQ & free sample

    • Focus on low to medium volume production

    • Quick & on-time delivery

    • Good quality & international approvals

    • Great customer service

    • Diversified shipping method

    • In-house PCB production

    • Wide range of PCB supplying

    • One stop turnkey EMS Service, including material procurement, SMT and thru-hole assembly, box build assembly

    • UL recognized and RoHS compliant


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