How to choose components and substrates for PCBA processing?

  Shenzhen VIASION Electronic Technology Co., Ltd. is a professional PCBA processing manufacturer with its own PCB board factory and SMT patch processing plant. It can provide PCB design, PCB board manufacturing, component purchasing, SMT patch, DIP plug-in, PCBA testing, finished product assembly, etc. Station PCBA processing service. Next, I will introduce how to choose components and substrates for PCBA processing?

  Standards for selecting components and substrates for PCBA processing

  1. Selection of components

  The selection of components should fully consider the needs of the actual area of the SMB, and use conventional components as much as possible. Do not blindly pursue small-size components to avoid increasing costs. IC devices should pay attention to the pin shape and pin spacing; the QFP with a pin spacing of less than 0.5mm should be carefully considered, it is better to directly use BGA packaged devices.

  In addition, factors such as the packaging form of components, PCB solderability, reliability of smt mounting, and temperature tolerance should all be considered. After selecting the components, a component database must be established, including relevant information such as installation dimensions, pin dimensions, and SMT manufacturers.

  2. The choice of base material

  The substrate should be selected according to the use conditions and mechanical and electrical performance requirements of the SMB. Determine the number of copper-clad surfaces of the substrate according to the SMB structure (single-sided, double-sided or multi-layer); determine the thickness of the substrate according to the SMB size and the quality of the components carried per unit area. When selecting SMB substrates, factors such as electrical performance requirements, Tg value (glass transition temperature), CTE, flatness, etc. should be considered, as well as factors such as price.