Factors affecting cost during SMT patch processing

Views:2     Author:Site Editor     Publish Time: 2021-07-31      Origin:Site Inquire

  Shenzhen Viasion has its own SMT chip factory, which can provide SMT chip processing services for the smallest package 0201 components, and supports processing with incoming samples and PCBA OEM materials. Next, I will introduce the process of SMT chip processing. Factors affecting cost.

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  Advantages of SMT processing

  SMT processing is essentially the technology of soldering the components to the PCB light board through related machinery and equipment. Although the expenditure on the cost of the machine is relatively large, it has its own unique advantages and characteristics compared with the traditional plug-in assembly. This technology has many advantages, such as the overall PCBA processing efficiency and the miniaturization of components. And miniaturization of finished product volume. Because the machine can be produced in large quantities, it greatly increases the cost increase and inefficiency caused by labor-related restrictions, which is a technological upgrade for the development of the entire electronics manufacturing industry.


  Factors affecting cost during SMT patch processing

  1. Solder Paste Printing

  The process involves placing an accurate amount of solder paste on the pads of the components to be soldered. For this reason, it is not only important that the solder paste is applied properly, but it is also important to store it properly at low temperatures and return to room temperature before applying it. In addition, you also need to pay attention to the scraping angle and speed.

 

  2. Solder paste inspection

  This step is very helpful in reducing costs, because it helps to find SMT soldering defects early. What it enables you to do is prevent costly defects in the later stages of manufacturing.

 

  3. Patch processing

  An important part of the SMT assembly process, which is completed by the placement machine. Although small components are mounted by high-speed placement machines, larger components require multi-function placement machines that run at low speeds.

 

  4. Manual visual inspection

  The visual inspection process once again ensures that any defects can be found early. Some of the errors that can be identified at this stage include any missing parts or lack of proper placement. After reflow soldering, it will be difficult to deal with these defects. Once again, this stage of SMT assembly allows cost control, as if this stage has not been implemented, you can expect to correct errors later and production costs will rise.

 

  5. Reflow soldering

  This process involves melting the solder paste so that the component can be connected to the circuit board. The temperature profile setting determines the reflow soldering ability and also reduces the production cost. Professional assemblers can control costs to a large extent.

 

  6. Automatic optical inspection

  At this stage, the performance of the solder joints is thoroughly checked. Some errors that can be detected at this stage include:

Tombstone, few pieces, dislocation, bridging, virtual welding, etc.

 

  7. X-ray detection

  Once again, X-ray inspection is a good way to ensure that products are efficient and do not have to contend with product defects after they are placed on the market.

 

  8. ICT or functional testing

  Functional testing will continue to test the functions of the assembled PCB to ensure that the final product is very reliable.


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