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8 layer rigid-flex PCB made by Dupont material with blind and buried via

8 layer rigid-flexible PCB
Flexible layer: layer 4-5,
Buried via: 2-7,
Blind via: layer 1-2, layer 7-8
minimum drill: 0.1mm,
Minimum trace width space: 4mil,
With impedance control,
Immersion gold finish
Availability:
Quantity:
  • PCB capabilities:

    • Rigid PCB up to 30 layers

    • Flexible PCB up to 6 layers

    • Rigid flex PCB up to 20 layers

    • Metal based PCB up to 8 layers

    • Material used: FR4, High TG FR4, Halogen free FR4, High frequency, Ceramic, Aluminum or Copper based, Polyimide, PTFE Hybrid

    • Surface finish: HAL, lead free HAL, immersion gold, silver, tin, OSP, hard gold plating, ENEPIG, carbon ink, blue mask

    • DHI technology: 1+n+1,1+1+n+1+1,2+n+2,3+n+3, stacked vias available

    • Other special technology: conductively (or non-conductively) via filling, edge plating, back drill, heavy copper (up to 14oz), Via in PAD filling, extreme large or thick PCB, microwave & RF circuit boards


  • Competitive advantages:

    • Good pricing

    • No MOQ & free sample

    • Focus on low to medium volume production

    • Quick & on-time delivery

    • Good quality & international approvals

    • Great customer service

    • Diversified shipping method

    • Wide range of PCB supplying

    • One stop Turnkey EMS service, including material procurement, SMT and thru-hole assembly, box build assembly

    • UL recognized and RoHS compliant





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